{"title":"Hybrid technique modeling of a generic feeding network for highly integrated RF transceivers","authors":"J.J. Wang, A. Lu, Y.P. Zhang","doi":"10.1109/EPTC.2004.1396691","DOIUrl":null,"url":null,"abstract":"This work presents the circuit modelling methodology of a generic feeding network for highly integrated RF transceiver modules. The feeding network consists of module or package interconnects including bond wires, signal traces and vias. Analytical and numerical modelling techniques are applied to calculate the circuit parameters. This circuit modelling approach is also compared with full-wave 3D electromagnetic simulations.","PeriodicalId":370907,"journal":{"name":"Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971)","volume":"25 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2004-12-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPTC.2004.1396691","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2
Abstract
This work presents the circuit modelling methodology of a generic feeding network for highly integrated RF transceiver modules. The feeding network consists of module or package interconnects including bond wires, signal traces and vias. Analytical and numerical modelling techniques are applied to calculate the circuit parameters. This circuit modelling approach is also compared with full-wave 3D electromagnetic simulations.
京公网安备 11010802042870号
京ICP备2023020795号-1
分享
求助内容：
应助结果提醒方式：
扫码关注我们
