SoC Engineering Trends as Impacted by New Applications and System Level Requirements

B. Candaele
{"title":"SoC Engineering Trends as Impacted by New Applications and System Level Requirements","authors":"B. Candaele","doi":"10.1109/ISQED.2005.111","DOIUrl":null,"url":null,"abstract":"Summary form only given. The SoC increasing integration scale as well as the system and customer requirements are important factors for a complete revisit of the development models for electronic products. New customer models ask for software driven electronics. Software engineering is moving to a component-based and MDA development approach to be applied to embedded applications. Hardware engineering is moving to SSDI system level development and reuse methodologies. The two approaches have now to be further developed and combined for next generation SoC to get high quality and adaptable designs at a reasonable development cost. New application-level quality standards have also to be part of the complete development flow. We demonstrated through several examples these new methodologies: system engineering methodology on software radios (UML, PIM (platform independent model) and PSM (platform specific model)) and its current extension to the hardware parts (SCA, OCP potential extensions), system engineering in line with the common criteria development and qualification process for new security products (PP (protection profile) and ST (security target)), development and validation methodology in line with DO254 standard for new safety products in avionics (formal verification). Impacts on SoC architectures and design techniques are discussed.","PeriodicalId":302936,"journal":{"name":"IEEE International Symposium on Quality Electronic Design","volume":"30 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2005-03-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE International Symposium on Quality Electronic Design","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISQED.2005.111","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

Abstract

Summary form only given. The SoC increasing integration scale as well as the system and customer requirements are important factors for a complete revisit of the development models for electronic products. New customer models ask for software driven electronics. Software engineering is moving to a component-based and MDA development approach to be applied to embedded applications. Hardware engineering is moving to SSDI system level development and reuse methodologies. The two approaches have now to be further developed and combined for next generation SoC to get high quality and adaptable designs at a reasonable development cost. New application-level quality standards have also to be part of the complete development flow. We demonstrated through several examples these new methodologies: system engineering methodology on software radios (UML, PIM (platform independent model) and PSM (platform specific model)) and its current extension to the hardware parts (SCA, OCP potential extensions), system engineering in line with the common criteria development and qualification process for new security products (PP (protection profile) and ST (security target)), development and validation methodology in line with DO254 standard for new safety products in avionics (formal verification). Impacts on SoC architectures and design techniques are discussed.
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
SoC工程趋势受新应用和系统级需求的影响
只提供摘要形式。SoC集成规模的不断扩大以及系统和客户的需求是全面重新审视电子产品开发模式的重要因素。新的客户模式要求软件驱动的电子产品。软件工程正在转向基于组件和MDA的开发方法,以应用于嵌入式应用程序。硬件工程正在转向SSDI系统级开发和重用方法。这两种方法现在需要进一步开发和结合,以实现下一代SoC以合理的开发成本获得高质量和适应性设计。新的应用程序级质量标准也必须成为完整开发流程的一部分。我们通过几个例子展示了这些新方法:软件无线电的系统工程方法(UML, PIM(平台独立模型)和PSM(平台特定模型))及其对硬件部分的当前扩展(SCA, OCP潜在扩展),符合新安全产品通用标准的系统工程开发和认证过程(PP(保护概要)和ST(安全目标)),符合DO254标准的航空电子新安全产品开发和验证方法(正式验证)。讨论了对SoC架构和设计技术的影响。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Exploiting Programmable Dipole Interaction in Straintronic Nanomagnet Chains for Ising Problems Emerging Interconnect Exploration for SRAM Application Using Nonconventional H-Tree and Center-Pin Access A2OP: an A* Algorithm OPtimizer with the Heuristic Function for PCB Automatic Routing A Bit-Parallel Deterministic Stochastic Multiplier Beyond Verilog: Evaluating Chisel versus High-level Synthesis with Tiny Designs
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1