Steady state lasing in strained germanium microbridges as fundamental measure for the crossover to direct band gap

F. A. Armand Pilon, Y. Niquet, J. Chrétien, N. Pauc, V. Reboud, V. Calvo, J. Widiez, J. Hartmann, A. Chelnokov, J. Faist, H. Sigg
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Abstract

The realization of a laser on silicon (Si) from group IV materials is a long-cherished wish of the semiconductor industry; it would enable the mass production of photonic systems at low cost. However, the path towards an efficient light emitter requires material with a direct band gap, in line with all the typical group III-V lasers platforms [1]-[4]. Such configuration can be achieved by loading Ge with tensile strain [5] by alloying with Sn [6] or both [7], [8]. Here, we demonstrate steady state lasing at low temperature in strained germanium microbridges and establish this finding as a fundamental probe for the conduction band line-up between the Γ and L minima.
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应变锗微桥中的稳态激光作为交叉直接带隙的基本措施
用IV族材料在硅(Si)上实现激光器是半导体行业的夙愿;这将使光子系统以低成本大规模生产成为可能。然而,通往高效光发射器的道路需要具有直接带隙的材料,这与所有典型的III-V族激光器平台一致[1]-[4]。这种结构可以通过与Sn[6]或同时与Sn[7],[8]合金化,使Ge承受拉伸应变[5]来实现。在这里,我们展示了应变锗微桥在低温下的稳态激光,并将这一发现作为Γ和L最小值之间导带排列的基本探针。
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