Electromagnetic characterization of high-speed VLSI interconnects with perforated reference planes

Abstract

Summary form only given. Within the limits of the quasi-TEM (transverse electromagnetic) approximation, the validity of a simple dispersive model for the electrical analysis of interconnections with perforated reference planes was examined. The advantage of this model is that simple 2-D transmission-line parameter extraction programs are mainly utilized and, combined with an appropriate electromagnetic analysis of the periodic interconnect geometry, lead to a computationally efficient prediction of the transmission line characteristics of the interconnections. The proposed model was extended to the electrical characterization of coupled interconnects, as well as interconnects located on either side of a perforated plane. Comparisons with experimental results and results obtained using rigorous full-wave techniques were used to demonstrate the validity of the proposed model.<>