Jean-Baptiste Doré, D. Belot, E. Mercier, Simon Bicaïs, G. Gougeon, Y. Corre, B. Miscopein, D. Kténas, E. Strinati
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引用次数: 21
Abstract
Wireless communication in millimeter wave bands, namely above 20 GHz and up to 300 GHz is foreseen as a key enabler technology for the next generation of wireless systems. The huge available bandwidth is contemplated to achieve high data rate wireless communications, and hence, to fulfill the requirements of future wireless networks. Several Beyond 5G applications are considered for these systems: high capacity backhaul, enhanced hot-spot kiosk as well as short-range Device-to-Device communications. In this paper we propose to discuss the trade-offs between scenario requirements and current silicon technologies limits to draw a technology roadmap for the next generation of wireless connectivity in D-band.
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