Polydimethylsiloxane/Glass-Based Composite Elastomer for Thermophysical Applications

E. V. Antonov, I. Sosnin, S. Vlassov, L. Dorogin
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Abstract

The possibility of reducing the thermal conductivity of the composite material based on polydimethylsiloxane by adding hollow glass microspheres as fillers was tested. Based on the data obtained, it can be concluded that a composite material containing microspheres at a concentration of 2.5% has a lower thermal conductivity coefficient by 40%, but also loses adhesion work and transparency in the optical range.
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热物理应用的聚二甲基硅氧烷/玻璃基复合弹性体
考察了在聚二甲基硅氧烷基复合材料中加入中空玻璃微球作为填料降低其导热性的可能性。根据所获得的数据,可以得出含有2.5%浓度微球的复合材料的导热系数降低了40%,但在光学范围内失去了粘附功和透明度。
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