H-T. Mammen, U. Sturmer, M. Koch, H. Kohne, K. Becker, W. John, H. Reichl
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引用次数: 0
Abstract
The modelling procedure described in this publication which is based on a partitioning of the total structure, allows a synthesis of the overall transfer function from simple, physics-motivated equations representing the behaviour of the substructures. Casting this into a Matlab description admits relatively easy combination with a GUI in order to obtain a modelling environment convenient for parameter studies during the development process. In parallel, some package solution for single-chip and array microphones are developed. During the model development it is not possible to consider all kinds of applications taking into account, so that some effects occur first at the finished product. Especially in a car application (handsfree set) for mobile phones occurred parasitic EMC effects. Based on this example, the EMC problems are described and solutions for circuit- as well as for package-level are presented.
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