Dan Bao, Chuan Wu, Yan Ying, Yun Chen, Xiaoyang Zeng
{"title":"A 4.32 mm2 170mW LDPC decoder in 0.13μm CMOS for WiMax/Wi-Fi applications","authors":"Dan Bao, Chuan Wu, Yan Ying, Yun Chen, Xiaoyang Zeng","doi":"10.1109/ASPDAC.2011.5722293","DOIUrl":null,"url":null,"abstract":"An energy-efficient programmable LDPC decoder is proposed for WiMax and Wi-Fi applications. The proposed decoder is designed with overlapped processing units, flexible message passing network and medium-grain partitioned memories to achieve flexibility, area reduction, and energy efficiency. The decoder can be programmed by host processor with several special-purpose micro-instructions. Thus, various operation modes can be reconfigured. Fabricated in SMIC 0.13μm 1P8M CMOS process, the chip occupies 4.32 mm2 with core area 2.97 mm2, and consumes 170mW with a throughput of 302Mb/s when operating at 145MHz and 1.2V.","PeriodicalId":316253,"journal":{"name":"16th Asia and South Pacific Design Automation Conference (ASP-DAC 2011)","volume":"44 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2011-01-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"16th Asia and South Pacific Design Automation Conference (ASP-DAC 2011)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ASPDAC.2011.5722293","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
An energy-efficient programmable LDPC decoder is proposed for WiMax and Wi-Fi applications. The proposed decoder is designed with overlapped processing units, flexible message passing network and medium-grain partitioned memories to achieve flexibility, area reduction, and energy efficiency. The decoder can be programmed by host processor with several special-purpose micro-instructions. Thus, various operation modes can be reconfigured. Fabricated in SMIC 0.13μm 1P8M CMOS process, the chip occupies 4.32 mm2 with core area 2.97 mm2, and consumes 170mW with a throughput of 302Mb/s when operating at 145MHz and 1.2V.