{"title":"Defect Reduction Using Yield Management Test Structures","authors":"H.M. Chou, C.C. Liu, C.J. Kuo, J.H. Hwang, N.W. Wu, M.C. Chang","doi":"10.1109/ISSM.1994.729442","DOIUrl":null,"url":null,"abstract":"Design and applications of Yield Management test patterns on memory products have been reviewed. Evaluations are made for Y.M. patterns and conventional T.K. patterns in terms of their ability to faithfully point out process deviations/defects and to predict CP yield. It s assessed that Y.M. patterns are superior to T.K. patterns in terms of the previous criteria. Finally, design guidelines will be also discussed.","PeriodicalId":114928,"journal":{"name":"International Symposium on Semiconductor Manufacturing, Extended Abstracts of ISSM","volume":"103 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1994-06-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"International Symposium on Semiconductor Manufacturing, Extended Abstracts of ISSM","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISSM.1994.729442","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
Design and applications of Yield Management test patterns on memory products have been reviewed. Evaluations are made for Y.M. patterns and conventional T.K. patterns in terms of their ability to faithfully point out process deviations/defects and to predict CP yield. It s assessed that Y.M. patterns are superior to T.K. patterns in terms of the previous criteria. Finally, design guidelines will be also discussed.
京公网安备 11010802042870号
京ICP备2023020795号-1
分享
求助内容：
应助结果提醒方式：
扫码关注我们
