{"title":"Material impact on FBGA package reliability","authors":"W. Koh, F. Kong","doi":"10.1109/ISAPM.2005.1432061","DOIUrl":null,"url":null,"abstract":"The materials used in a fine pitch ball grid array (FBGA) package for dynamic random access memory (DRAM) module assembly is investigated under environmental stress to accelerate failure. These failure modes and mechanisms are investigated and design changes and material selections altered to improve the overall package reliability. Failure analysis included using X-ray and ultrasonic scan, as well as cross sectioning and scanning electronic micrograph (SEM).","PeriodicalId":181674,"journal":{"name":"Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005.","volume":"159 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2005-03-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISAPM.2005.1432061","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 3
Abstract
The materials used in a fine pitch ball grid array (FBGA) package for dynamic random access memory (DRAM) module assembly is investigated under environmental stress to accelerate failure. These failure modes and mechanisms are investigated and design changes and material selections altered to improve the overall package reliability. Failure analysis included using X-ray and ultrasonic scan, as well as cross sectioning and scanning electronic micrograph (SEM).
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