{"title":"Insulation technology for power semiconductor modules","authors":"H. Muto, H. Shiota, T. Hasegawa","doi":"10.1109/ISEIM.2008.4664606","DOIUrl":null,"url":null,"abstract":"As key devices for power conversion, we can expect power semiconductor modules to become increasingly sophisticated in functions and performance in the years to come. This will require the development of advanced insulation materials and design technologies.","PeriodicalId":158811,"journal":{"name":"2008 International Symposium on Electrical Insulating Materials (ISEIM 2008)","volume":"38 9","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2008-10-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2008 International Symposium on Electrical Insulating Materials (ISEIM 2008)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISEIM.2008.4664606","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
As key devices for power conversion, we can expect power semiconductor modules to become increasingly sophisticated in functions and performance in the years to come. This will require the development of advanced insulation materials and design technologies.
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