Reliable On-Chip Memory Design for CMPs

Abbas BanaiyanMofrad
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引用次数: 1

Abstract

Aggressive technology scaling in deep sub micron regime makes chips more susceptible to failures. This causes multiple realibility challenges in the design of modern chips, including manufacturing defects, wear-out, and parametric variations. With increasing area occupied by different on-chip memories in modern computing platforms such as Chip Multi-Processors (CMPs), memory reliability becomes a challenging issue. Traditional on-chip memory reliability techniques (e.g., ECC) incur significant power and performance overheads. To tackle such challenges, my research introduces several designs for fault-tolerance of both L1 and L2 cache memories in uni-core processors [1], Last-level Cache (LLC) in CMPs [3][4], and LLC in Networks-on-Chip (NoCs) [2].
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可靠的cmp片上存储器设计
在深亚微米范围内的激进技术缩放使芯片更容易发生故障。这给现代芯片的设计带来了多重可靠性挑战,包括制造缺陷、损耗和参数变化。随着芯片多处理器(cmp)等现代计算平台中不同的片上存储器所占的空间越来越大,存储器的可靠性成为一个具有挑战性的问题。传统的片上存储器可靠性技术(例如,ECC)会产生显著的功耗和性能开销。为了应对这些挑战,我的研究介绍了单核处理器[1]中L1和L2缓存存储器的容错设计,cmp[3][4]中的最后一级缓存(LLC),以及片上网络(noc)[2]中的LLC。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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