QFN-based Millimeter Wave Packaging to 80GHz

Abstract

This paper describes a low-cost plastic QFN package capable of addressing increasing frequency needs. This package has low-loss, high-bandwidth and is based around MicroCoax interconnect technology. Since this package structure is broadband, it will easily allow for a variety of chipsets to be assembled using the same process sequence and I/O configuration, thereby eliminating costly overhead. With less than 0.5 dB insertion-loss and ≫ 15dB return-loss per RF interconnect at 50GHz, this 5×5 mm QFN package will allow existing bare-die only applications to enter the world of high-speed PCB assembly. Process technology, I/O performance, active device performance, PCB board material selection and test protocol are discussed.