J. Granados-Samaniego, J. M. Velázquez-Arcos, C. Vargas, F. Tavera R, R. H. Hernandez Lopez
{"title":"Resonant Technology and Electromagnetic Packaging","authors":"J. Granados-Samaniego, J. M. Velázquez-Arcos, C. Vargas, F. Tavera R, R. H. Hernandez Lopez","doi":"10.1109/ICEAA.2015.7297218","DOIUrl":null,"url":null,"abstract":"Under the concept of the so called Resonant Technology, recently we had proposed a device that can transport a lot of different signals, all of them of similar frequencies although different recording time, packed around the resonant frequencies. With the aim to implement physically the device, we had developed an algorithm, which is inserted in a FPGA to build information packs and send it. Also, we analyze the Gap Waveguide Electromagnetic Packaging Technology, taking into account the signal integrity and the Electromagnetic Broadband Packaging Model.","PeriodicalId":277112,"journal":{"name":"2015 International Conference on Electromagnetics in Advanced Applications (ICEAA)","volume":"40 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2015-10-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2015 International Conference on Electromagnetics in Advanced Applications (ICEAA)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICEAA.2015.7297218","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2
Abstract
Under the concept of the so called Resonant Technology, recently we had proposed a device that can transport a lot of different signals, all of them of similar frequencies although different recording time, packed around the resonant frequencies. With the aim to implement physically the device, we had developed an algorithm, which is inserted in a FPGA to build information packs and send it. Also, we analyze the Gap Waveguide Electromagnetic Packaging Technology, taking into account the signal integrity and the Electromagnetic Broadband Packaging Model.
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