Logic block and design methodology for via-configurable structured ASIC using dual supply voltages

Ta-Kai Lin, Kuen-Wey Lin, Chang-Hao Chiu, Rung-Bin Lin
{"title":"Logic block and design methodology for via-configurable structured ASIC using dual supply voltages","authors":"Ta-Kai Lin, Kuen-Wey Lin, Chang-Hao Chiu, Rung-Bin Lin","doi":"10.1145/2591513.2591601","DOIUrl":null,"url":null,"abstract":"This paper presents a via-configurable logic block and a design methodology for realizing fine-grained dual-supply-voltage structured ASIC. Experiments with a 90nm process technology show that, given various timing budgets, our approach can achieve up to 44% energy reduction with 1.6% area overhead on level converters. Compared with GECVS, our approach converts up to 39% more high-supply voltage gates into low-supply voltage gates.","PeriodicalId":272619,"journal":{"name":"ACM Great Lakes Symposium on VLSI","volume":"54 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2014-05-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"ACM Great Lakes Symposium on VLSI","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1145/2591513.2591601","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
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Abstract

This paper presents a via-configurable logic block and a design methodology for realizing fine-grained dual-supply-voltage structured ASIC. Experiments with a 90nm process technology show that, given various timing budgets, our approach can achieve up to 44% energy reduction with 1.6% area overhead on level converters. Compared with GECVS, our approach converts up to 39% more high-supply voltage gates into low-supply voltage gates.
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使用双电源电压的可配置结构化ASIC的逻辑模块和设计方法
本文提出了一种可通过可配置逻辑块和实现细粒度双电源电压结构化ASIC的设计方法。采用90nm工艺技术的实验表明,在给定不同时间预算的情况下,我们的方法可以在电平转换器上实现高达44%的能耗降低,面积开销为1.6%。与GECVS相比,我们的方法将高达39%的高电源电压门转换为低电源电压门。
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