Performance of four-stage thermoelectric cooler for extended wavelength InGaAs detectors

D. Mo, Li-yi Yang, Dafu Liu, Qin-fei Xu, Tao Li, Xue Li
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引用次数: 3

Abstract

Experimental setup for evaluating four-stage thermoelectric cooler’s performance was designed. Effects of input power, heat dissipation condition and heat load on the temperature difference (ΔT) of four-stage thermoelectric coolers’ hot and cold faces were obtained experimentally. The result shows that, the ΔT increases as the input power increases. A linear relationship exists between input current and feedback voltage. In different cooling conditions, the ΔT of thermoelectric cooler (TEC) increases with the temperature of hot face. As the temperature increasing on hot face is 1K, the ΔT increasing of TEC can be about 0.5K. Meanwhile, the power consumption of TEC also increases slightly. Water condensation can be prevented in either dry nitrogen environment or vacuum environment, but the vacuum level has great influence to the ΔT, especially in low operation temperature. The better the vacuum level is, the smaller the convection heat loss has. When the operation temperature of focal plane array (FPA) is lower than 220K, it is prior to use vacuum packaging. Considering the Joule-heat of readout circuit and the heat loss of wire conduction, the minimum working temperature of FPA can reach below 200 K when the temperature of the hot face is 285K. And the coefficient of performance (COP) of TEC can increase sharply from 0.8% to 4% when the controlled operation temperature is 220K rather than 200K.
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扩展波长InGaAs探测器的四级热电冷却器性能
设计了评价四级热电冷却器性能的实验装置。实验得到了输入功率、散热条件和热负荷对四级热电冷却器冷热面温差的影响(ΔT)。结果表明,ΔT随输入功率的增大而增大。输入电流和反馈电压之间存在线性关系。在不同的冷却条件下,热电冷却器(TEC)的ΔT随热面温度的升高而增大。当热面升温1K时,TEC的ΔT升温可达0.5K左右。同时,TEC的功耗也略有增加。干氮环境和真空环境均可防止冷凝水,但真空度对ΔT的影响较大,特别是在低运行温度下。真空度越高,对流热损失越小。当焦平面阵列(FPA)的工作温度低于220K时,应优先使用真空封装。考虑到读出电路的焦耳热和导线传导的热损失,当热面温度为285K时,FPA的最低工作温度可达200 K以下。当控制工作温度为220K而不是200K时,TEC的性能系数(COP)可以从0.8%急剧提高到4%。
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