Thermal conductivity of Cu7.2Ni1.8Si1Cr copper alloy produced via SLM and ability of thin-wall structure fabrication

J. Mašek, D. Koutný, R. Popela
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引用次数: 3

Abstract

Three parts a disk with inner holes and two cylinders with thin-wall web of 0.325 mm and 1.625 mm were produced by Selective laser melting technology from a copper alloy Cu7.2Ni1.8Si1Cr powder. Based on the previous experience with this copper material, the fabrication was successfully processed with up to 5 % dimensional accuracy according to CAD model. The fabricated samples were tested in an experimental thermo-vacuum chamber to reveal the material thermal conductivity since no data are freely available. Based on the reference samples testing, the evaluation process was upgraded by considering a heat transfer by radiation. The measured thermal conductivity of the SLM produced alloy Cu7.2Ni1.8Si1Cr was 3.4 times lower than the value of a bulk material AMPCOLOY 944 with a similar chemical composition.
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SLM法制备Cu7.2Ni1.8Si1Cr铜合金的导热系数及薄壁结构制备能力
以Cu7.2Ni1.8Si1Cr铜合金粉末为原料,采用选择性激光熔化技术制备了带内孔的圆盘和两个薄壁壁蹼(0.325 mm和1.625 mm)圆柱体。根据以前使用这种铜材料的经验,根据CAD模型,该制造成功地以高达5%的尺寸精度进行加工。由于没有现成的数据,制备的样品在实验热真空室中进行了测试,以揭示材料的导热性。在参考样品测试的基础上,将评价过程升级为考虑辐射传热。SLM制备的Cu7.2Ni1.8Si1Cr合金的热导率比具有相似化学成分的块状材料AMPCOLOY 944低3.4倍。
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