ECPR (electrochemical pattern replication): metal printing for advanced packaging applications

Abstract

ECPR (electrochemical pattern replication) is a new fabrication process for the production of microstructures in conducting materials. Using ECPR, the cost of metallization for advanced packaging solutions can be significantly reduced compared to using lithography based processes. The technology utilizes a reusable master electrode for electrochemical pattern replication, which enables direct metallization with short cycle times, high throughput and comparably low equipment investments. ECPR provides metallization on most substrates such as silicon wafers, ceramic substrates and flexible or rigid organic substrates. The technique currently enables pattern transfer of copper structures down to 5/5 /spl mu/m line/space with uniform material distribution and high resolution patterns with small line width variations. Results from replication studies on both ultrathin polyimide substrates and silicon wafers are presented.