K. Mitchell, D. Willett, C. Eberspacher, J. Ermer, D. Pier, K. Pauls
{"title":"41.5 watt, 10.5% Si:H/CuInSe/sub 2/ tandem thin film modules","authors":"K. Mitchell, D. Willett, C. Eberspacher, J. Ermer, D. Pier, K. Pauls","doi":"10.1109/PVSC.1990.111855","DOIUrl":null,"url":null,"abstract":"Thin-film tandem modules using semitransparent Si:H alloy (TFS) and CuInSe/sub 2/ (CIS) component circuits show promise of achieving high photovoltaic performance using low-cost thin-film processing. TFS/CIS (thin-film Si:H/CuInSe/sub 2/) tandem modules with 41.5 W and 10.5% aperture efficiency on 0.4 m/sup 2/ areas have been demonstrated. Film deposition and patterning processes have been successfully extended to 0.4 m/sup 2/ substrates. The larger size is comparable with conventional single-crystal silicon commercial modules and represents a prototype high-efficiency thin-film power product. The performance characteristics of the individual CIS and TFS cells and submodules and of the tandem TFS/CIS cells and modules are described.<<ETX>>","PeriodicalId":211778,"journal":{"name":"IEEE Conference on Photovoltaic Specialists","volume":"81 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1990-05-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Conference on Photovoltaic Specialists","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/PVSC.1990.111855","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2
Abstract
Thin-film tandem modules using semitransparent Si:H alloy (TFS) and CuInSe/sub 2/ (CIS) component circuits show promise of achieving high photovoltaic performance using low-cost thin-film processing. TFS/CIS (thin-film Si:H/CuInSe/sub 2/) tandem modules with 41.5 W and 10.5% aperture efficiency on 0.4 m/sup 2/ areas have been demonstrated. Film deposition and patterning processes have been successfully extended to 0.4 m/sup 2/ substrates. The larger size is comparable with conventional single-crystal silicon commercial modules and represents a prototype high-efficiency thin-film power product. The performance characteristics of the individual CIS and TFS cells and submodules and of the tandem TFS/CIS cells and modules are described.<>
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