L. Cheran, P. Lam, Z. Zheng, S. Boggs, M. Thompson
{"title":"Characterization of dielectric materials using a high-resolution scanning Kelvin-microprobe","authors":"L. Cheran, P. Lam, Z. Zheng, S. Boggs, M. Thompson","doi":"10.1109/CEIDP.2003.1254783","DOIUrl":null,"url":null,"abstract":"The scanning Kelvin microprobe is a powerful technique to characterize subtle changes in surface microstructure and local chemical properties through the simultaneously imaging of the topography and potential distribution across a surface at the sub-micron level. The study of dielectric materials using the Kelvin method opens a new area of applications for a technique traditionally reserved specifically for metals and, more recently, for semiconductor materials. We present here the capabilities of this new instrument, the characterization of dielectric samples and the related challenges, as well as Finite Element Analysis models of this particular type of insulating surfaces.","PeriodicalId":306575,"journal":{"name":"2003 Annual Report Conference on Electrical Insulation and Dielectric Phenomena","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2003-10-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2003 Annual Report Conference on Electrical Insulation and Dielectric Phenomena","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/CEIDP.2003.1254783","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 4
Abstract
The scanning Kelvin microprobe is a powerful technique to characterize subtle changes in surface microstructure and local chemical properties through the simultaneously imaging of the topography and potential distribution across a surface at the sub-micron level. The study of dielectric materials using the Kelvin method opens a new area of applications for a technique traditionally reserved specifically for metals and, more recently, for semiconductor materials. We present here the capabilities of this new instrument, the characterization of dielectric samples and the related challenges, as well as Finite Element Analysis models of this particular type of insulating surfaces.