Investigation on Reading Discrepancy of Type T and Type J Thermocouples

2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Pub Date : 2020-07-01 DOI:10.1109/ITherm45881.2020.9190272

Wenbin Tian, Michael Berktold, C. Carte, Ellen Tan

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引用次数: 1

Abstract

Thermocouples are widely used in industry for temperature measurement due to their high accuracy and sensitivity. However, thermocouples can act as a heatsink or a heat spreader when attached onto the top surface of small components like Voltage Regulator Modules (VRM), Capacitors, Platform Controller Hubs (PCH), and etcetera. This could alter cooling conditions of components, consequently leading to temperature measurement discrepancy on these modules. This discrepancy could be more obvious for smaller components without a heatsink or heat spreader attached. Also, the potential discrepancy relies on not only package material of components but the type of thermocouples considering the different thermocouple wire composition. This paper focuses on investigating temperature measurement discrepancies for 36-gauge type T and 36-gauge type J thermocouples on components without heatsinks or heat spreaders attached. Analysis is performed with both numerical simulation modeling using the CFD tool FloTHERM and actual testing measurements based on Intel commercial server products.

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T型和J型热电偶读数差异的研究

热电偶因其高精度和高灵敏度而广泛应用于工业温度测量。然而，热电偶可以作为一个散热器或散热器连接到小的组件，如电压调节器模块(VRM)，电容器，平台控制器集线器(PCH)，等等的上表面。这可能会改变组件的冷却条件，从而导致这些模块的温度测量差异。对于没有散热器或散热器的较小组件，这种差异可能更明显。此外，电势差异不仅取决于组件的封装材料，还取决于考虑不同热电偶导线组成的热电偶类型。本文重点研究了36规T型和36规J型热电偶在没有散热器或散热器的组件上的温度测量差异。分析使用CFD工具FloTHERM进行数值模拟建模，并基于英特尔商用服务器产品进行实际测试测量。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

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