High Speed Ethernet Interface between TE and MT in 3GPP LTE Network

Abstract

Data rates in 3GPP LTE supports 100Mbps in the downlink and 50Mbps in the uplink. Currently, almost all manufactured MTs uses HDLC_PPP to make connections between TE and MT. However HDLC_PPP uses byte stuffing for HDLC framing. As the communication speed is increased dramatically between TE and MT, byte stuffing seriously limits communication speed. As the connection methods between TE and MT and between MT and RN Care different, HDLC_PPP used between TE and MT can be replaced by other method without affecting the wireless interface. We propose an Ethernet interface instead of HDLC_PPP interface. The Ethernet-based interface provides higher data throughput than that of HDLC_PPP. The test result shows that data throughputs of HDLC_PPP over USB, pure Ethernet, and Ethernet over USB are 18Mbps,95Mbps, and 68Mbps respectively.