Tunable low-voltage dual-directional ESD protection for RFICs

Jian Liu, Lin Lin, Xin Wang, H Zhao, He Tang, Q. Fang, Albert Z. H. Wang, Liwu Yang, Haolu Xie, S. Fan, B. Zhao, Gary Zhang, Xingang Wang
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引用次数: 3

Abstract

This paper reports a tunable low triggering voltage, dual-directional SCR ESD protection structure in CMOS for RF ICs. A new embedded gate-coupling technique is used to reduce and adjust its triggering voltage. Experiment shows a low discharging resistance of ∼0.26Ω, low leakage current of ∼0.19nA, low parasitic capacitance of ∼150fF and ultra fast response time of ∼100pS. This structure achieves ESD protection of >9.20kV HBM and >500V CDM for a 90µm device. A high ESD protection to Si ratio of ESDV∼8.17V/µm2 is obtained for RF IC applications.
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rfic的可调低压双向ESD保护
本文报道了一种用于射频集成电路的CMOS可调低触发电压、双向可控硅ESD保护结构。采用一种新的嵌入式栅极耦合技术来降低和调节其触发电压。实验表明,放电电阻低~ 0.26Ω,漏电流低~ 0.19nA,寄生电容低~ 150fF,响应时间超快~ 100pS。该结构在90µm器件上实现了>9.20kV HBM和>500V CDM的ESD保护。对于射频集成电路应用,获得了ESDV ~ 8.17V/µm2的高ESD保护硅比。
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