UTBB SOI MOSFETs with gate-source/drain underlap and ground plane (GP) structures for analog/RF applications

N. Othman, M. K. Md Arshad, S. Sabki, S. R. Kasjoo, U. Hashim
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Abstract

In this work, we report on the influence of underlap architecture (LUL) and ground plane (GP) on the analog/RF performance metrics of Ultra-Thin Body and Buried Oxide (UTBB) Fully-Depleted (FD) SOI MOSFETs with 25 nm gate length. Small-signal transconductance (gm), gate-to-gate capacitance (Cgg) and the cut-off frequency (ft) are the figures-of-merit (FoM) of interest. It is shown that longer underlap i.e. LUL = 10 nm showed lower gm. However, it is noted that Cgg also decreases as the underlap increases. Thus, the need for trade-off between gm and Cgg is needed to achieve optimum values of ft. From this work, it is found that the impact of gm on ft is more prominent than Cgg. From another point of view, the impact of different GP structures on gm and ft becomes more apparent at longer underlap.
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UTBB SOI mosfet具有门源/漏极下接和地平面(GP)结构,用于模拟/RF应用
在这项工作中,我们报告了覆盖结构(LUL)和地平面(GP)对具有25 nm栅极长度的超薄体和埋藏氧化物(UTBB)全耗尽(FD) SOI mosfet的模拟/RF性能指标的影响。小信号跨导(gm)、门对门电容(Cgg)和截止频率(ft)是我们感兴趣的优值(FoM)。结果表明,较长的覆盖(即LUL = 10 nm)显示较低的gm。然而,值得注意的是,Cgg也随着覆盖的增加而降低。因此,需要在gm和Cgg之间进行权衡,以达到ft的最优值。从这项工作中,我们发现gm对ft的影响比Cgg更突出。从另一个角度来看,不同GP结构对gm和ft的影响在较长的覆盖下变得更加明显。
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