Preparation, morphology and thermoelectric performance of PEDOT/CuI nanocomposites

Joherul Alam, Xiao Su, Hsu-Chiang Kuan, Shahraam Afshar Vahid, Kamil Zuber, Qingshi Meng, Fanzhe Meng, Dusan Losic, Jun Ma
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Abstract

Incorporating inorganic nanomaterials into a polymer matrix is one of the most effective ways to create thermoelectric performance for applications where physical flexibility is essential. In this study, flexible thermoelectric nanocomposite films were synthesized by incorporating inorganic copper iodide (CuI) nanosheets as the filler into poly (3,4-ethylene dioxythiophene): poly (styrene sulfonate) (PEDOT: PSS). The process involved the preparation of bulk CuI from precursors and, subsequently, the nanosheet synthesis by dissolving the bulk CuI in dimethyl sulfoxide (DMSO). The morphology of the nanosheets and the nanocomposite films was thoroughly examined, and the film’s thermoelectric performance was evaluated using a standard thermoelectric measurement system, ZEM-3. The morphological observation revealed a triangular nanosheet geometry for CuI, with an average lateral dimension of ~33 nm. The PEDOT/CuI nanocomposite films were prepared by mixing CuI nanosheets with PEDOT: PSS through ultrasonication and filtration on a PVDF membrane. The film with 6.9 vol% of CuI nanosheets exhibited an electrical conductivity and Seebeck coefficient of 852.07 S·cm-1 and 14.95 µV·K-1, respectively. This resulted in an enhanced power factor of 19.04 µW·m-1·K-2, much higher than the individual composite components. It demonstrated a trend of increasing power factor with the nanosheets up to 6.9 vol% due to improved electrical conductivity. The increase in electrical conductivity can be attributed to the screening effect induced by DMSO, which leads to a conformational change in the PEDOT chains. Furthermore, an optimal fraction of CuI nanosheets also contributes to this conformational change, further enhancing the electrical conductivity.

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PEDOT/CuI纳米复合材料的制备、形貌及热电性能
将无机纳米材料结合到聚合物基体中是创造热电性能的最有效方法之一,用于物理灵活性至关重要的应用。在本研究中,将无机碘化铜(CuI)纳米片作为填料加入到聚(3,4-乙烯二氧噻吩):聚(苯乙烯磺酸盐)(PEDOT: PSS)中,合成了柔性热电复合纳米薄膜。该工艺包括从前体制备本体CuI,随后通过将本体CuI溶解在二甲基亚砜(DMSO)中合成纳米片。研究了纳米片和纳米复合薄膜的形貌,并使用标准热电测量系统ZEM-3对薄膜的热电性能进行了评估。形态学观察显示,CuI的纳米片呈三角形几何形状,平均横向尺寸为~33 nm。将CuI纳米片与PEDOT: PSS混合,在PVDF膜上通过超声波和过滤制备PEDOT/CuI纳米复合膜。含有6.9体积% CuI纳米片的薄膜电导率和塞贝克系数分别为852.07 S·cm-1和14.95µV·K-1。这导致功率因数提高到19.04µW·m-1·K-2,远远高于单个复合元件。由于电导率的提高,纳米片的功率因数有增加的趋势,达到6.9%。电导率的提高可归因于DMSO诱导的筛选效应,这导致PEDOT链的构象改变。此外,最佳比例的CuI纳米片也有助于这种构象变化,进一步提高电导率。图形抽象
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