Impact of Ferroelectric Material BaTiO3 on Negative Capacitance TFET Device and Its Circuit Application

IF 0.7 4区 工程技术 Q4 ENGINEERING, ELECTRICAL & ELECTRONIC Integrated Ferroelectrics Pub Date : 2023-09-02 DOI:10.1080/10584587.2023.2227054
Amandeep Singh, Sanjeet Kumar Sinha, Sweta Chander
{"title":"Impact of Ferroelectric Material BaTiO<sub>3</sub> on Negative Capacitance TFET Device and Its Circuit Application","authors":"Amandeep Singh, Sanjeet Kumar Sinha, Sweta Chander","doi":"10.1080/10584587.2023.2227054","DOIUrl":null,"url":null,"abstract":"With the increase in scaling of transistors in nanometer regime, various short channel effects are emerging in transistor operation that are required to resolved while putting conventional transistor to any practical application. Various device modifications and structure improvizations have been made and reported by the researchers to overcome the short channel effects and replace the conventional MOSFET with an optimized device in practical circuit applications. The device structure proposed in this work incorporates the negative capacitance phenomenon for making subthreshold swing steeper and enhancing current ratio of TFET. Further the device dimensions are being optimized to get improvised characteristics and best results are obtained at 3 nm thick BaTiO3 Ferroelectric material for making negative capacitance gate stack. In this paper, negative capacitance TFET so formed is used for implementing inverter and 1 T DRAM cell. Results obtained shows that the inverter and DRAM cell operates at a very lower supply voltage and are more suitable for low power applications as compared to conventional circuits.","PeriodicalId":13686,"journal":{"name":"Integrated Ferroelectrics","volume":"10 1","pages":"0"},"PeriodicalIF":0.7000,"publicationDate":"2023-09-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Integrated Ferroelectrics","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1080/10584587.2023.2227054","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q4","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0

Abstract

With the increase in scaling of transistors in nanometer regime, various short channel effects are emerging in transistor operation that are required to resolved while putting conventional transistor to any practical application. Various device modifications and structure improvizations have been made and reported by the researchers to overcome the short channel effects and replace the conventional MOSFET with an optimized device in practical circuit applications. The device structure proposed in this work incorporates the negative capacitance phenomenon for making subthreshold swing steeper and enhancing current ratio of TFET. Further the device dimensions are being optimized to get improvised characteristics and best results are obtained at 3 nm thick BaTiO3 Ferroelectric material for making negative capacitance gate stack. In this paper, negative capacitance TFET so formed is used for implementing inverter and 1 T DRAM cell. Results obtained shows that the inverter and DRAM cell operates at a very lower supply voltage and are more suitable for low power applications as compared to conventional circuits.
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
铁电材料BaTiO3对负电容TFET器件的影响及其电路应用
随着纳米尺度下晶体管尺寸的增大,晶体管工作中出现了各种各样的短沟道效应,传统晶体管在实际应用中必须加以解决。为了克服短沟道效应,并在实际电路应用中用优化的器件取代传统的MOSFET,研究人员已经对器件进行了各种修改和结构改进。本文所提出的器件结构结合了负电容现象,使TFET的亚阈值摆幅更陡,提高了电流比。此外,还对器件尺寸进行了优化以获得临时特性,并在3nm厚的BaTiO3铁电材料上获得了最佳效果,用于制作负电容栅极堆。本文采用负电容TFET来实现逆变器和1t DRAM单元。结果表明,与传统电路相比,逆变器和DRAM单元工作在非常低的电源电压下,更适合于低功耗应用。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
Integrated Ferroelectrics
Integrated Ferroelectrics 工程技术-工程:电子与电气
CiteScore
1.40
自引率
0.00%
发文量
179
审稿时长
3 months
期刊介绍: Integrated Ferroelectrics provides an international, interdisciplinary forum for electronic engineers and physicists as well as process and systems engineers, ceramicists, and chemists who are involved in research, design, development, manufacturing and utilization of integrated ferroelectric devices. Such devices unite ferroelectric films and semiconductor integrated circuit chips. The result is a new family of electronic devices, which combine the unique nonvolatile memory, pyroelectric, piezoelectric, photorefractive, radiation-hard, acoustic and/or dielectric properties of ferroelectric materials with the dynamic memory, logic and/or amplification properties and miniaturization and low-cost advantages of semiconductor i.c. technology.
期刊最新文献
Investigation of Coatings Formed by Thermal Oxidation on Monocrystalline Silicon Design of a Dual-Chamber Piezoelectric-Driven Micro Blower: Example of Heat Dissipation Use Modeling for Efficiency Enhancement of Perovskite Thin-Film Solar Cell by Using Double-Absorber and Buffer Layers Effect of Different Mn Doping Content on Electrical Properties of KNN Piezoelectric Ceramic Coatings Study on Safe Working Condition of the Electrothermal U-Shaped Actuator
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1