MXene (Ti3C2Tx)/TMD (ReSe2) Nanohybrid-based Flexible Electromechanical Sensors for Cervical Collar Strain and Shoulder Load Detection Applications

IF 2.4 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Journal of Micromechanics and Microengineering Pub Date : 2023-09-29 DOI:10.1088/1361-6439/acfc52
Vivek Adepu, Manav Tathacharya, Raghuram CS, Parikshit Sahatiya
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Abstract

Abstract The possibly complex impacts of volunteer’s heavy backpacks, chronic neck pain are significant concerns and must be considered by the scientific and academic community. However already existing several alert systems can tackle these issues, but the evaluation approaches are costly and complicated. In this regard, ReSe 2 /Ti 3 C 2 T x nanohybrid based flexible sensors were fabricated by low-cost vacuum filtration technique and integrated into cervical collar strain and shoulder load detection alert systems to tackle these issues. The fabricated sensor displayed an excellent gauge factor of 14.38 and an improved sensitivity of 14.06 kPa −1 . The response and recovery time of the pressure and strain sensor were 288 and 90 msec at 15% strain and 95 and 182 msec at 1.477 kPa pressure. There was a negligible degradation in performance when the pressure sensor was assessed for 5000 and the strain sensor for 4500 cycles, proving that the fabricated sensors are highly durable. The comprehensive underlying transduction mechanism is elucidated by intrinsic piezoresistive properties of nanohybrid (ReSe 2 /Ti 3 C 2 T x ) and Schottky barrier height mechanism with complete electronic bandstructure realization using real-time ultraviolet photoelectron spectroscopy. Also, to transfer/receive data wirelessly on an Android/ios based smartphone, the fabricated sensors were connected to an electrical circuit with a microcontroller and Bluetooth module. The effective corroboration of the ReSe 2 /Ti 3 C 2 T x nanohybrid based physical sensors initiates innovative prospects in the field of flexible electronics.
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MXene (Ti3C2Tx)/TMD (ReSe2)纳米混合柔性机电传感器用于颈部应变和肩部载荷检测
志愿者沉重的背包和慢性颈部疼痛可能产生的复杂影响是值得关注的,必须得到科学界和学术界的重视。然而,现有的几个警报系统可以解决这些问题,但评估方法昂贵且复杂。为此,采用低成本真空过滤技术制备了基于ReSe 2 /Ti 3 C 2 T x纳米杂化柔性传感器,并将其集成到颈部应变和肩部负载检测报警系统中。该传感器的测量系数为14.38,灵敏度为14.06 kPa−1。压力和应变传感器在15%应变下的响应时间为288和90 msec,在1.477 kPa压力下的响应时间为95和182 msec。当压力传感器被评估为5000次,应变传感器被评估为4500次时,性能的下降可以忽略不计,证明制造的传感器是高度耐用的。利用实时紫外光电子能谱技术,利用纳米杂化材料(ReSe 2 / ti3c2tx)的固有压阻特性和完整电子带结构的肖特基势垒高度机制,阐明了全面的潜在转导机制。此外,为了在基于Android/ios的智能手机上无线传输/接收数据,制造的传感器与微控制器和蓝牙模块连接在一起。ReSe 2 / ti3c2tx纳米杂化物理传感器的有效验证,为柔性电子领域开辟了创新的前景。
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来源期刊
Journal of Micromechanics and Microengineering
Journal of Micromechanics and Microengineering 工程技术-材料科学:综合
CiteScore
4.50
自引率
4.30%
发文量
136
审稿时长
2.8 months
期刊介绍: Journal of Micromechanics and Microengineering (JMM) primarily covers experimental work, however relevant modelling papers are considered where supported by experimental data. The journal is focussed on all aspects of: -nano- and micro- mechanical systems -nano- and micro- electomechanical systems -nano- and micro- electrical and mechatronic systems -nano- and micro- engineering -nano- and micro- scale science Please note that we do not publish materials papers with no obvious application or link to nano- or micro-engineering. Below are some examples of the topics that are included within the scope of the journal: -MEMS and NEMS: Including sensors, optical MEMS/NEMS, RF MEMS/NEMS, etc. -Fabrication techniques and manufacturing: Including micromachining, etching, lithography, deposition, patterning, self-assembly, 3d printing, inkjet printing. -Packaging and Integration technologies. -Materials, testing, and reliability. -Micro- and nano-fluidics: Including optofluidics, acoustofluidics, droplets, microreactors, organ-on-a-chip. -Lab-on-a-chip and micro- and nano-total analysis systems. -Biomedical systems and devices: Including bio MEMS, biosensors, assays, organ-on-a-chip, drug delivery, cells, biointerfaces. -Energy and power: Including power MEMS/NEMS, energy harvesters, actuators, microbatteries. -Electronics: Including flexible electronics, wearable electronics, interface electronics. -Optical systems. -Robotics.
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