{"title":"Simultaneous estimation of reference temperature and heat transfer coefficient in transient film cooling problems","authors":"Vashista ADEMANE, Ravikiran KADOLI, Vijaykumar HINDASAGERI","doi":"10.18186/thermal.1332543","DOIUrl":null,"url":null,"abstract":"This paper aims to simultaneously estimate the reference temperature and heat transfer coefficient in film cooling situations from transient temperature measurements. The exist-ing steady-state technique is a tedious process and employs distinct boundary conditions to evaluate each parameters of the film cooling. Applying different boundary conditions may lead to errors in the estimated parameters due to differences in aerodynamic condi-tions. On the other hand, a transient technique can estimate both parameters in a single test by utilizing short-duration transient temperature data. Hence, the present study uses a novel approach for solving transient film cooling problems based on the inverse heat con-duction approach, which can simultaneously estimate heat transfer coefficient and refer-ence temperature. The present method employs an optimization technique known as the Levenberg-Marquardt Algorithm. The objective function for the inverse algorithm is con-structed using the analytical solution of a transient one-dimensional semi-infinite body. The transient surface temperature data required for the present analysis is obtained through a numerical simulation of film cooling arrangement over a flat surface. Laterally averaged effectiveness and heat transfer coefficient for blowing ratios of 0.5, 0.8, and 1.0 are analyzed using the present technique and compared against the steady-state simulation results to demonstrate the methodology. An average deviation of around 7% for the estimated effec-tiveness and 4% for the heat transfer coefficient values are observed between the present IHCP method and the steady state simulation results. The deviation in heat transfer coeffi-cient predominately occurred near the film hole exit of x/d < 5, which might have occurred due to the conjugate solution employed in the present work.","PeriodicalId":45841,"journal":{"name":"Journal of Thermal Engineering","volume":null,"pages":null},"PeriodicalIF":1.1000,"publicationDate":"2023-05-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Thermal Engineering","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.18186/thermal.1332543","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"Engineering","Score":null,"Total":0}
引用次数: 0
Abstract
This paper aims to simultaneously estimate the reference temperature and heat transfer coefficient in film cooling situations from transient temperature measurements. The exist-ing steady-state technique is a tedious process and employs distinct boundary conditions to evaluate each parameters of the film cooling. Applying different boundary conditions may lead to errors in the estimated parameters due to differences in aerodynamic condi-tions. On the other hand, a transient technique can estimate both parameters in a single test by utilizing short-duration transient temperature data. Hence, the present study uses a novel approach for solving transient film cooling problems based on the inverse heat con-duction approach, which can simultaneously estimate heat transfer coefficient and refer-ence temperature. The present method employs an optimization technique known as the Levenberg-Marquardt Algorithm. The objective function for the inverse algorithm is con-structed using the analytical solution of a transient one-dimensional semi-infinite body. The transient surface temperature data required for the present analysis is obtained through a numerical simulation of film cooling arrangement over a flat surface. Laterally averaged effectiveness and heat transfer coefficient for blowing ratios of 0.5, 0.8, and 1.0 are analyzed using the present technique and compared against the steady-state simulation results to demonstrate the methodology. An average deviation of around 7% for the estimated effec-tiveness and 4% for the heat transfer coefficient values are observed between the present IHCP method and the steady state simulation results. The deviation in heat transfer coeffi-cient predominately occurred near the film hole exit of x/d < 5, which might have occurred due to the conjugate solution employed in the present work.
期刊介绍:
Journal of Thermal Enginering is aimed at giving a recognized platform to students, researchers, research scholars, teachers, authors and other professionals in the field of research in Thermal Engineering subjects, to publish their original and current research work to a wide, international audience. In order to achieve this goal, we will have applied for SCI-Expanded Index in 2021 after having an Impact Factor in 2020. The aim of the journal, published on behalf of Yildiz Technical University in Istanbul-Turkey, is to not only include actual, original and applied studies prepared on the sciences of heat transfer and thermodynamics, and contribute to the literature of engineering sciences on the national and international areas but also help the development of Mechanical Engineering. Engineers and academicians from disciplines of Power Plant Engineering, Energy Engineering, Building Services Engineering, HVAC Engineering, Solar Engineering, Wind Engineering, Nanoengineering, surface engineering, thin film technologies, and Computer Aided Engineering will be expected to benefit from this journal’s outputs.