{"title":"Machining mechanism of polycrystalline Nickel-based alloy under ultrasonic elliptical vibration-assisted cutting","authors":"Duy-Khanh Nguyen, Te-Hua Fang, Yue-Ru Cai, Ching-Chien Huang","doi":"10.1088/1361-651x/ad0316","DOIUrl":null,"url":null,"abstract":"Abstract This work investigates the machining mechanism and deformation behavior of NiFeCo under conventional nanoscale cutting and ultrasonic elliptical vibration-assisted cutting (UEVC) through Molecular Dynamics (MD) simulation. The material removal process is considered in various vibration frequencies, amplitude ratios, and phase angles. In both cases, the highest shear strain, local stress, and temperature atoms mostly locate in the cutting area and chip volume, but the magnitudes are more significant under UEVC. The distribution analysis results of stacking fault and dislocation also show that grain boundaries strongly influence the deformation behavior and the local stress in the material. Moreover, in the cases of UEVC, the rise of vibration frequency and the decrease in amplitude ratio positively impact improving the material removal rate (MRR) and reducing the average cutting force. Meanwhile, the change in phase angles affects only the timing of the peak in force value and has no significant effect on the resultant force and the cutting efficiency.","PeriodicalId":18648,"journal":{"name":"Modelling and Simulation in Materials Science and Engineering","volume":"17 1","pages":"0"},"PeriodicalIF":1.9000,"publicationDate":"2023-10-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Modelling and Simulation in Materials Science and Engineering","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1088/1361-651x/ad0316","RegionNum":4,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"MATERIALS SCIENCE, MULTIDISCIPLINARY","Score":null,"Total":0}
引用次数: 0
Abstract
Abstract This work investigates the machining mechanism and deformation behavior of NiFeCo under conventional nanoscale cutting and ultrasonic elliptical vibration-assisted cutting (UEVC) through Molecular Dynamics (MD) simulation. The material removal process is considered in various vibration frequencies, amplitude ratios, and phase angles. In both cases, the highest shear strain, local stress, and temperature atoms mostly locate in the cutting area and chip volume, but the magnitudes are more significant under UEVC. The distribution analysis results of stacking fault and dislocation also show that grain boundaries strongly influence the deformation behavior and the local stress in the material. Moreover, in the cases of UEVC, the rise of vibration frequency and the decrease in amplitude ratio positively impact improving the material removal rate (MRR) and reducing the average cutting force. Meanwhile, the change in phase angles affects only the timing of the peak in force value and has no significant effect on the resultant force and the cutting efficiency.
期刊介绍:
Serving the multidisciplinary materials community, the journal aims to publish new research work that advances the understanding and prediction of material behaviour at scales from atomistic to macroscopic through modelling and simulation.
Subject coverage:
Modelling and/or simulation across materials science that emphasizes fundamental materials issues advancing the understanding and prediction of material behaviour. Interdisciplinary research that tackles challenging and complex materials problems where the governing phenomena may span different scales of materials behaviour, with an emphasis on the development of quantitative approaches to explain and predict experimental observations. Material processing that advances the fundamental materials science and engineering underpinning the connection between processing and properties. Covering all classes of materials, and mechanical, microstructural, electronic, chemical, biological, and optical properties.