EFFECT OF LOW-POWER LASER IRRADIATION ON THE SHEAR BOND STRENGTH AND THERMAL CHANGES ACROSS DIFFERENT ZIRCONIA THICKNESSES USING DIFFERENT IRRADIATION TIMES.

Jaccare T Jauregui-Ulloa, Nena W Hawkins, Seth T Lirette, Taylor J Ward, Susana M Salazar Marocho
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Abstract

Purpose: To investigate the effect of irradiation time and zirconia thickness using low power Er,Cr:YSGG laser irradia)on (for debonding purposes) on the thermal changes and shear bond strength (SBS) of resin-bonded 3% mol yIrium oxide stabilized tetragonal zirconia polycrystal (3YTZP) specimens.

Materials and methods: 3Y-TZP slices of 0.5-, 2-, and 3- mm thick were used. The temperatures during laser irradiation using single spot irradiation at different times (30 seconds, 60 seconds, 90 seconds, and 120 seconds) and line scanning irradiation from one spot to another at three different distances (2, 4, and 6 mm) were recorded. Single spot and line scanning irradiation data were analyzed using three-way ANOVA (α = .05) and generalized linear mixed model, respectively. Nonirradiated (control) and irradiated resin-bonded 3Y-TZP specimens were shear tested, and the data were analyzed using two-way ANOVA (α = .05).

Results: Under single spot irradiation, the laser-induced temperature was higher through thin 3Y-TZP at any time compared to thick 3Y-TZP. For the line scanning method, short distances (2 and 4 mm) resulted in a significant increase in temperature for 0.5-mm thick specimens. Laser irradiation significantly decreased the SBS of the 0.5-mm group compared to the nonirradiated group. After irradiation, the bond strength of the 2- and 3-mm thick 3Y-TZP was similar to the nonirradiated group.

Conclusions: The temperature and bond strength of low-power laser irradiated 3Y-TZP specimens was affected by the specimen thickness but not by the irradiation time tested. Low-power laser irradiation is an effective debonding method for thin Y-TZP restorations.

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低功率激光辐照时间对不同氧化锆厚度剪切结合强度及热变化的影响。
目的:研究低功率Er,Cr:YSGG激光(用于脱键)辐照时间和氧化锆厚度对树脂键合3% mol氧化钇稳定四方氧化锆多晶(3Y-TZP)试样的热变化和剪切键合强度的影响。材料与方法:采用0.5、2、3mm厚的3Y-TZP切片。记录了不同时间(30,60,90,120s)单点激光照射过程中的温度,以及不同距离(2-,4-和6- mm)从一个点到另一个点的线扫描照射。单点扫描和线扫描辐照数据分别采用三向方差分析(α: 0.05)和广义线性混合模型进行分析。对未辐照(对照)和辐照树脂粘接的3Y-TZP试样进行剪切试验,数据采用双因素方差分析(α: 0.05)。结果:在单点照射下,薄3Y-TZP在任何时间的激光诱导温度均高于厚3Y-TZP。对于线扫描方法,在0.5 mm厚的样品中,短距离(2和4 mm)导致温度显著升高。与未照射组相比,激光照射显著降低了0.5 mm组的剪切结合强度。照射后,2和3mm厚3Y-TZP的结合强度与未照射组相似。结论:低功率激光辐照3Y-TZP试样的温度和粘结强度受试样厚度的影响,而不受辐照时间的影响。低功率激光照射是一种有效的薄Y-TZP修复方法。
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