{"title":"Comparative analysis of compressive strength of epoxy adhesive compounds containing fillers","authors":"Jacek Ogrodniczek, Anna Rudawska, Miroslav Müller","doi":"10.1080/00218464.2023.2286295","DOIUrl":null,"url":null,"abstract":"The aim of this paper was to analyse the compressive strength and structure of epoxy adhesive compounds containing three different fillers with good thermal conductivity, additionally prepared in v...","PeriodicalId":501232,"journal":{"name":"The Journal of Adhesion","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2023-11-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"The Journal of Adhesion","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1080/00218464.2023.2286295","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
The aim of this paper was to analyse the compressive strength and structure of epoxy adhesive compounds containing three different fillers with good thermal conductivity, additionally prepared in v...
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