A Dual Neural Network Approach to Topology Optimization for Thermal-Electromagnetic Device Design

IF 3 3区 计算机科学 Q2 COMPUTER SCIENCE, SOFTWARE ENGINEERING Computer-Aided Design Pub Date : 2023-12-05 DOI:10.1016/j.cad.2023.103665
Benjamin A. Jasperson , Michael G. Wood , Harley T. Johnson
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Abstract

Topology optimization for engineering problems often requires multiphysics (dual objective functions) and multi-timescale considerations to be coupled with manufacturing constraints across a range of target values. We present a dual neural network approach to topology optimization to optimize a 3-dimensional thermal-electromagnetic device (optical shutter) for maximum temperature rise across a range of extinction ratios while also considering manufacturing tolerances. One neural network performs the topology optimization, allocating material to each sub-pixel within a repeating unit cell. The size of each sub-pixel is selected with manufacturing considerations in mind. The other neural network is trained to predict performance of the device using extinction ratio and temperature rise over a given time period. Training data is generated using a finite element model for both the electromagnetic wave frequency domain and thermal time domain problems. Optimized designs across a range of targets are shown.

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热电磁器件拓扑优化的双神经网络方法
工程问题的拓扑优化通常需要多物理场(双目标函数)和多时间尺度考虑,并结合一系列目标值的制造约束。我们提出了一种双神经网络拓扑优化方法,以优化三维热电磁器件(光学快门)在消光比范围内的最大温升,同时考虑制造公差。一个神经网络执行拓扑优化,将材料分配到重复单元格中的每个子像素。每个子像素的大小是根据制造考虑因素来选择的。另一个神经网络被训练来使用消光比和给定时间段内的温升来预测设备的性能。训练数据是用有限元模型生成的,用于电磁波频域和热时域问题。展示了一系列目标的优化设计。
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来源期刊
Computer-Aided Design
Computer-Aided Design 工程技术-计算机:软件工程
CiteScore
5.50
自引率
4.70%
发文量
117
审稿时长
4.2 months
期刊介绍: Computer-Aided Design is a leading international journal that provides academia and industry with key papers on research and developments in the application of computers to design. Computer-Aided Design invites papers reporting new research, as well as novel or particularly significant applications, within a wide range of topics, spanning all stages of design process from concept creation to manufacture and beyond.
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