Ioannis Lampouras, Mathias Holz, Steffen Strehle, Julia Körner
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引用次数: 0
Abstract
Dynamic-mode cantilever sensors are based on the principle of a one-side clamped beam being excited to oscillate at or close to its resonance frequency. An external interaction on the cantilever alters its oscillatory state, and this change can be detected and used for quantification of the external influence (e.g. a force or mass load). A very promising approach to significantly improve sensitivity without modifying the established laser-based oscillation transduction is the co-resonant coupling of a micro- and a nanocantilever. Thereby, each resonator is optimized for a specific purpose, i.e. the microcantilever for reliable oscillation detection and the nanocantilever for highest sensitivity through low rigidity and mass. To achieve the co-resonant state, the eigenfrequencies of micro- and nanocantilever need to be adjusted so that they differ by less than approximately 20%. This can either be realized by mass deposition or trimming of the nanocantilever, or by choice of dimensions. While the former is a manual and error-prone process, the latter would enable reproducible batch fabrication of coupled systems with predefined eigenfrequency matching states and therefore sensor properties. However, the approach is very challenging as it requires a precisely controlled fabrication process. Here, for the first time, such a process for batch fabrication of inherently geometrically eigenfrequency matched co-resonant cantilever structures is presented and characterized. It is based on conventional microfabrication techniques and the structures are made from 1 µm thick low-stress silicon nitride. They comprise the microcantilever and high aspect ratio nanocantilever (width 2 µm, thickness about 100 nm, lengths up to 80 µm) which are successfully realized with only minimal bending. An average yield of >80% of intact complete sensor structures per wafer is achieved. Desired geometric dimensions can be realized within ±1% variation for length and width of the microcantilever and nanocantilever length, ±10% and ±20% for the nanocantilever width and thickness, respectively, resulting in an average variation of its eigenfrequency by 11%. Furthermore, the dynamic oscillation properties are verified by vibration experiments in a scanning electron microscope. The developed process allows for the first time the batch fabrication of co-resonantly coupled systems with predefined properties and controlled matching states. This is an important step and crucial foundation for a broader applicability of the co-resonant approach for sensitivity enhancement of dynamic-mode cantilever sensors.
期刊介绍:
Journal of Micromechanics and Microengineering (JMM) primarily covers experimental work, however relevant modelling papers are considered where supported by experimental data.
The journal is focussed on all aspects of:
-nano- and micro- mechanical systems
-nano- and micro- electomechanical systems
-nano- and micro- electrical and mechatronic systems
-nano- and micro- engineering
-nano- and micro- scale science
Please note that we do not publish materials papers with no obvious application or link to nano- or micro-engineering.
Below are some examples of the topics that are included within the scope of the journal:
-MEMS and NEMS:
Including sensors, optical MEMS/NEMS, RF MEMS/NEMS, etc.
-Fabrication techniques and manufacturing:
Including micromachining, etching, lithography, deposition, patterning, self-assembly, 3d printing, inkjet printing.
-Packaging and Integration technologies.
-Materials, testing, and reliability.
-Micro- and nano-fluidics:
Including optofluidics, acoustofluidics, droplets, microreactors, organ-on-a-chip.
-Lab-on-a-chip and micro- and nano-total analysis systems.
-Biomedical systems and devices:
Including bio MEMS, biosensors, assays, organ-on-a-chip, drug delivery, cells, biointerfaces.
-Energy and power:
Including power MEMS/NEMS, energy harvesters, actuators, microbatteries.
-Electronics:
Including flexible electronics, wearable electronics, interface electronics.
-Optical systems.
-Robotics.