A. V. Zemlyanov, D. D. Gatiyatullina, V. R. Utyaganova, E. Dymnich, N. N. Shamarin, S. Yu. Nikonov, V. A. Romanova, A. S. Kulkov, R. R. Balokhonov
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引用次数: 0
Abstract
Experimental and numerical studies were conducted on AlSi12 alloy fabricated by wire-feed electron beam additive manufacturing to examine the structure, thermomechanical behavior and fracture of a eutectic microvolume at the scale of several microns. Dynamic boundary value problems were solved under plane strain conditions. The composite structure of the eutectic phase consisting of an aluminum matrix and silicon particles was taken into account explicitly in the calculations. Isotropic models of the thermoelastoplastic matrix and elastic-brittle particles were implemented in ABAQUS/Explicit. Composite deformation was calculated both with and without allowance for residual stresses caused by cooling of the composite after its fabrication. It was shown that after the cooling of the eutectic, silicon particles are compressed, and the aluminum matrix is under both bulk compressive and tensile as well as under pure shear stresses. It was found that residual stresses play a negative role at the stages of intense deformation of the composite. The fracture strain of the eutectic strongly depends on the yield point of the matrix, while the ultimate fracture stress varies but only slightly. Favorable morphology of silicon particles was determined which prevents early fracture of the eutectic.
期刊介绍:
The journal provides an international medium for the publication of theoretical and experimental studies and reviews related in the physical mesomechanics and also solid-state physics, mechanics, materials science, geodynamics, non-destructive testing and in a large number of other fields where the physical mesomechanics may be used extensively. Papers dealing with the processing, characterization, structure and physical properties and computational aspects of the mesomechanics of heterogeneous media, fracture mesomechanics, physical mesomechanics of materials, mesomechanics applications for geodynamics and tectonics, mesomechanics of smart materials and materials for electronics, non-destructive testing are viewed as suitable for publication.