{"title":"Influence of Cu/Ni interlayers on rotary friction welded dissimilar SS321–Ti6Al4V joints","authors":"Neeraj Kumar Mishra, SGK Manikandan, Neethu N., Amber Shrivastava","doi":"10.1080/10426914.2023.2290241","DOIUrl":null,"url":null,"abstract":"Joining of stainless steel (SS) and Ti alloys offers lightweight, cost-efficient, and versatile part design options across various industries. This work incorporates Cu and Ni interlayers and compa...","PeriodicalId":18266,"journal":{"name":"Materials and Manufacturing Processes","volume":null,"pages":null},"PeriodicalIF":4.1000,"publicationDate":"2023-12-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Materials and Manufacturing Processes","FirstCategoryId":"88","ListUrlMain":"https://doi.org/10.1080/10426914.2023.2290241","RegionNum":2,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, MANUFACTURING","Score":null,"Total":0}
引用次数: 0
Abstract
Joining of stainless steel (SS) and Ti alloys offers lightweight, cost-efficient, and versatile part design options across various industries. This work incorporates Cu and Ni interlayers and compa...
期刊介绍:
Materials and Manufacturing Processes deals with issues that result in better utilization of raw materials and energy, integration of design and manufacturing activities requiring the invention of suitable new manufacturing processes and techniques, unmanned production dependent on efficient and reliable control of various processes including intelligent processing, introduction of new materials in industrial production necessitating new manufacturing process technology, and more. Information is offered in various formats, including research articles, letter reports, review articles, conference papers, applied research, book and conference reviews, and entire issues devoted to symposia.
All submitted manuscripts are subject to initial appraisal by the Editors, and, if found suitable for further consideration, to peer review by independent, anonymous expert referees. All peer review is single blind and submission is online via ScholarOne Manuscripts.