Effects of Electron Beam Sterilization on Polytetrafluoroethylene: Design of Experiments Study.

Q4 Medicine Biomedical Instrumentation and Technology Pub Date : 2023-01-01 Epub Date: 2024-01-03 DOI:10.2345/0899-8205-57.4.117
Rishabh Jain
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Abstract

Polytetrafluoroethylene (PTFE) is a common polymer used in medical devices due to its exceptional properties (e.g., biocompatibility, inertness, chemical stability, low coefficient of friction). However, as a result of molecular weight reduction caused by the process of chain scission, it is known to be susceptible to radiation exposure and can rapidly lose strength and integrity. In this design of experiments study, the goal was to determine whether an operating window of conditions exist for electron beam (E-beam) radiation sterilization in which the degradation of PTFE is acceptably low. PTFE was tested for yield stress after exposure to radiation under different parameters (total dose [15-60 kGy], packaging atmosphere [air/nitrogen], and poststerilization accelerated aging [real-time equivalent of 1 and 3 years]). The results showed that total dose and packaging atmosphere were significant factors and indicated that the use of modified atmosphere packaging (vacuum sealing with nitrogen gas purge) can be a useful approach in increasing the stability of PTFE toward E-beam sterilization.

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电子束灭菌对聚四氟乙烯的影响:实验设计研究。
聚四氟乙烯(PTFE)因其优异的性能(如生物相容性、惰性、化学稳定性、低摩擦系数)而成为医疗器械中常用的聚合物。然而,众所周知,由于链裂解过程导致分子量降低,聚四氟乙烯容易受到辐射照射,并会迅速失去强度和完整性。在这项实验设计研究中,目的是确定在电子束(E-beam)辐射灭菌条件下是否存在可接受的低聚四氟乙烯降解操作窗口。在不同参数(总剂量[15-60 kGy]、包装气氛[空气/氮气]和灭菌后加速老化[实时相当于 1 年和 3 年])下,对 PTFE 暴露于辐射后的屈服应力进行了测试。结果表明,总剂量和包装气氛是重要的影响因素,并表明使用改良气氛包装(带氮气吹扫的真空密封)是提高聚四氟乙烯对电子束灭菌稳定性的有效方法。
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来源期刊
Biomedical Instrumentation and Technology
Biomedical Instrumentation and Technology Computer Science-Computer Networks and Communications
CiteScore
1.10
自引率
0.00%
发文量
16
期刊介绍: AAMI publishes Biomedical Instrumentation & Technology (BI&T) a bi-monthly peer-reviewed journal dedicated to the developers, managers, and users of medical instrumentation and technology.
期刊最新文献
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