Experimental In-Situ Observatory on Brownian Motion Behavior of 105 nm Sized Silica Particles During Chemical Mechanical Polishing of 4H-SiC by an Evanescent Field

IF 0.9 Q4 AUTOMATION & CONTROL SYSTEMS International Journal of Automation Technology Pub Date : 2024-01-05 DOI:10.20965/ijat.2024.p0047
Thitipat Permpatdechakul, P. Khajornrungruang, Keisuke Suzuki, A. Blattler, J. Inthiam
{"title":"Experimental In-Situ Observatory on Brownian Motion Behavior of 105 nm Sized Silica Particles During Chemical Mechanical Polishing of 4H-SiC by an Evanescent Field","authors":"Thitipat Permpatdechakul, P. Khajornrungruang, Keisuke Suzuki, A. Blattler, J. Inthiam","doi":"10.20965/ijat.2024.p0047","DOIUrl":null,"url":null,"abstract":"The experimentally observing optical systems for on-machine measurement have been developed to study on nano-polishing phenomena during the chemical mechanical polishing process, which is a wet process in semiconductor manufacturing. The developed optical system employs an evanescent field to selectively enhance exclusively the observatory of phenomena occurring on the surface being polished, offering a lateral resolving power of approximately 400 nm, in the slurry concentration of up to 5 wt% based on the numerical aperture of the objective lens. In addition, there is also the observability of 105 nm and down to 55 nm-sized silica particles without requiring additive fluorescence agents in or around the nano-particles, even when these particles are moving on surfaces such as silica glass or hard materials (silicon carbide: 4H-SiC). Consequently, the motion behavior of nano-particles disjoining with polishing pad asperity was explored and discussed, in this paper. Experimental results revealed that the polishing pad spatially constrains the movement of particles between the pad and the substrate surface, guiding them toward the surface being polished. During pad sliding, fluidically dragged nano-particles exhibit slower movement than the polishing pad sliding speed while retaining the Brownian motion. Furthermore, 105 nm-sized silica particles did not continuously approach to attach onto the SiC surface; the nano-particles approached in steps with reduced Brownian motion in all directions before attaching. This behavior can be attributed to the effects of van der Waals attraction and electrostatic repulsion forces between the particle and the substrate surfaces.","PeriodicalId":43716,"journal":{"name":"International Journal of Automation Technology","volume":null,"pages":null},"PeriodicalIF":0.9000,"publicationDate":"2024-01-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"International Journal of Automation Technology","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.20965/ijat.2024.p0047","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q4","JCRName":"AUTOMATION & CONTROL SYSTEMS","Score":null,"Total":0}
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Abstract

The experimentally observing optical systems for on-machine measurement have been developed to study on nano-polishing phenomena during the chemical mechanical polishing process, which is a wet process in semiconductor manufacturing. The developed optical system employs an evanescent field to selectively enhance exclusively the observatory of phenomena occurring on the surface being polished, offering a lateral resolving power of approximately 400 nm, in the slurry concentration of up to 5 wt% based on the numerical aperture of the objective lens. In addition, there is also the observability of 105 nm and down to 55 nm-sized silica particles without requiring additive fluorescence agents in or around the nano-particles, even when these particles are moving on surfaces such as silica glass or hard materials (silicon carbide: 4H-SiC). Consequently, the motion behavior of nano-particles disjoining with polishing pad asperity was explored and discussed, in this paper. Experimental results revealed that the polishing pad spatially constrains the movement of particles between the pad and the substrate surface, guiding them toward the surface being polished. During pad sliding, fluidically dragged nano-particles exhibit slower movement than the polishing pad sliding speed while retaining the Brownian motion. Furthermore, 105 nm-sized silica particles did not continuously approach to attach onto the SiC surface; the nano-particles approached in steps with reduced Brownian motion in all directions before attaching. This behavior can be attributed to the effects of van der Waals attraction and electrostatic repulsion forces between the particle and the substrate surfaces.
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在蒸发场作用下对 4H-SiC 进行化学机械抛光时 105 nm 大小二氧化硅颗粒的布朗运动行为进行原位观测实验
我们开发了用于机上测量的实验观测光学系统,用于研究化学机械抛光过程(半导体制造中的一种湿法工艺)中的纳米抛光现象。根据物镜的数值孔径,在研磨液浓度高达 5 wt% 的情况下,所开发的光学系统可提供约 400 nm 的横向分辨力。此外,即使这些颗粒在硅玻璃或硬质材料(碳化硅:4H-SiC)等表面上运动,也无需在纳米颗粒内部或周围添加荧光剂,即可观察到 105 纳米甚至 55 纳米大小的二氧化硅颗粒。因此,本文探讨并讨论了纳米颗粒与抛光垫表面脱节的运动行为。实验结果表明,抛光垫在空间上限制了颗粒在抛光垫和基底表面之间的运动,引导它们朝向被抛光的表面。在抛光垫滑动过程中,被流体拖动的纳米颗粒的运动速度低于抛光垫的滑动速度,但仍保持布朗运动。此外,105 nm 大小的二氧化硅微粒并没有持续地靠近并附着在碳化硅表面上;纳米微粒在附着前,在各个方向上的布朗运动都有所减弱。这种行为可归因于颗粒与基底表面之间的范德华吸引力和静电排斥力的影响。
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来源期刊
International Journal of Automation Technology
International Journal of Automation Technology AUTOMATION & CONTROL SYSTEMS-
CiteScore
2.10
自引率
36.40%
发文量
96
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