{"title":"Latest research progress of SiCp/Al composite for electronic packaging","authors":"Hong Yu, Liu Jiaqin, Wu Yucheng","doi":"10.1515/rams-2023-0158","DOIUrl":null,"url":null,"abstract":"With the rapid development, microelectronic technology has put forward strict requirements for electronic packaging materials (EPMs). SiCp/Al composites with high volume fraction of SiC has become an ideal candidate for EPMs due to their superior properties including high thermal conductivity, tailorable coefficient of thermal expansion as well as low density in many fields. This study reviewed the manufacturing process of SiCp/Al composites in recent years. In addition, the interface between particle and matrix, the application, and the development trend of SiCp/Al composites has also been summarized.","PeriodicalId":54484,"journal":{"name":"Reviews on Advanced Materials Science","volume":"169 1","pages":""},"PeriodicalIF":3.9000,"publicationDate":"2024-01-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Reviews on Advanced Materials Science","FirstCategoryId":"88","ListUrlMain":"https://doi.org/10.1515/rams-2023-0158","RegionNum":4,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"MATERIALS SCIENCE, MULTIDISCIPLINARY","Score":null,"Total":0}
引用次数: 0
Abstract
With the rapid development, microelectronic technology has put forward strict requirements for electronic packaging materials (EPMs). SiCp/Al composites with high volume fraction of SiC has become an ideal candidate for EPMs due to their superior properties including high thermal conductivity, tailorable coefficient of thermal expansion as well as low density in many fields. This study reviewed the manufacturing process of SiCp/Al composites in recent years. In addition, the interface between particle and matrix, the application, and the development trend of SiCp/Al composites has also been summarized.
期刊介绍：
Reviews on Advanced Materials Science is a fully peer-reviewed, open access, electronic journal that publishes significant, original and relevant works in the area of theoretical and experimental studies of advanced materials. The journal provides the readers with free, instant, and permanent access to all content worldwide; and the authors with extensive promotion of published articles, long-time preservation, language-correction services, no space constraints and immediate publication.
Reviews on Advanced Materials Science is listed inter alia by Clarivate Analytics (formerly Thomson Reuters) - Current Contents/Physical, Chemical, and Earth Sciences (CC/PC&ES), JCR and SCIE. Our standard policy requires each paper to be reviewed by at least two Referees and the peer-review process is single-blind.
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