Thermally Driven Multi-Objective Packing Optimization Using Acceleration Fields

Connor Moffatt, Jae Sung Huh, Sangook Jun, Il Yong Kim
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Abstract

The packing optimization of three-dimensional components into a design space is a challenging and time-intensive task. Of particular concern is the thermal performance of the system, as tightly packed components typically exhibit poor heat dissipation performance which can result in overheating and system failure. As temperature modelling can be quite complex, there is growing demand in industry for software tools that aid designers in the packing process whilst considering heat transfer. This work outlines a novel multi-objective algorithm that considers temperature and thermal effects directly within the packing optimization process itself using thermal optimization objectives. In addition, the algorithm can consider functional objectives such as a desired center of mass position and minimizing rotational inertia. The algorithm packs components from initial to optimal positions within a design domain using a set of dynamic acceleration fields. There are multiple accelerations, each designed to improve the objective values for the systems (for example, minimize temperature variance). Component temperatures are calculated using thermal finite element analyses modelling conduction and natural convection. Forced convection is approximated via computational fluid dynamics simulations. Numerical results for two academic and one real-world case studies are presented to demonstrate the efficacy of the presented algorithm.
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利用加速场进行热驱动多目标包装优化
在设计空间内对三维组件进行包装优化是一项具有挑战性且耗时的任务。尤其值得关注的是系统的热性能,因为紧密封装的组件通常散热性能较差,可能导致过热和系统故障。由于温度建模可能相当复杂,工业界对软件工具的需求日益增长,这些软件工具可以在考虑热传导的同时,帮助设计人员进行封装。这项工作概述了一种新颖的多目标算法,该算法利用热优化目标,在包装优化过程中直接考虑温度和热效应。此外,该算法还能考虑功能目标,如理想的质心位置和最小化转动惯量。该算法使用一组动态加速度场,在设计域内将组件从初始位置打包到最佳位置。有多种加速度,每种加速度都旨在改善系统的目标值(例如,最小化温度差异)。元件温度是通过模拟传导和自然对流的热有限元分析计算得出的。强制对流通过计算流体动力学模拟进行近似。介绍了两个学术案例研究和一个实际案例研究的数值结果,以证明所介绍算法的有效性。
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