Coverage and reliability improvement of copper metallization layer in through hole at BGA area during load board manufacture

Abstract

The dimple of ball grid array (BGA) area with 70 mm × 70 mm size on load board for high performance integrated circuit final test is investigated by shadow moire at first, the dimple of BGA area decreases from 184.3 to 97.1 μm when six additional prepregs with 60 mm × 60 mm size are added at BGA area before hot lamination process. The micromorphology and stress/strain simulation are conducted to improve the coverage and reliability of copper metallization layer in through hole at that BGA area. The microcracks of electroless copper layer at the position of glass fiber and inner layer copper pad, which leads to serious crack after solder float, are well covered by subsequent electroplating copper layer. When the through holes at BGA area with 0.2 mm diameter and 7.0 mm depth are fabricated based on insulating dielectric material used for high-speed signal transmission, the simulation results point out that IT968 is better than M6G for the thermal shock reliability of through hole metallization layer. A load board vehicle with 126 layers and 8.3 mm thickness based on IT968 shows good interconnection structure reliability after 12 times 288°C solder float.