Numerical investigations of water jet-guided laser cutting of silicon

Abstract

To investigate the interaction mechanism between a laser, water jet, and substrate, a model is developed to simulate the temperature field evolution and removal process during water jet-guided laser (WJGL) cutting of silicon. The model accounted for the temperature-dependent properties of the silicon absorption coefficient, as well as the physical processes of solid-liquid-gas phase change. A three-dimensional finite volume model of WJGL cutting of silicon is created, incorporating laser energy input, water jet impact-cooling, and silicon phase transition and removal. The volume of fluid (VOF) method is employed to trace the interphase interface and obtain the groove shape. The validity of the model is verified by comparing simulation results with experimental data. The simulation results show that the groove cross section is characterized by a “V” shape. The groove depth nonlinearly increases from 52 to 385 μm with an increasing number of cuts. Additionally, the residual temperature of the silicon substrate rises from 837 to 1345 K as the number of scans increases from 1 to 10. The findings offer valuable insights into WJGL cutting research, specifically shedding light on the intricate details of the laser-water jet-substrate interaction mechanism.