The Study of the Effect of Surfactants on Copper Codeposition with SiC Nano Particulate from Deep Eutectic Solvent Ionic Liquids (Ethaline)

K. E. Ttaib, A. Benhmid
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Abstract

Here we investigate the electrolytic deposition of copper and copper nano composites in the absence and the presence of two types of surfactants: cationic which is sodium dodecyl sulphate (SDS)  and the other type is cetyl  trimethyl ammonium bromide (CTAB) from a solution of the metal chloride salt in ethylene glycol–choline chloride based eutectics. The SEM images and EDAX analysis allow in situ quantification or particulate inclusion. It is quite interesting to perceive that the composition of composite material was strongly dependent on the amount of species suspended in solution. Again the data here has revealed that the majority of material was dragged onto the surface rather than settling on to it. The distribution of the composite material was found to be even throughout the coating. This technology is important because it facilitates deposition of bright copper coatings without co-ligands such as cyanide which is not friendly environment.
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表面活性剂对深共晶溶剂离子液体(乙醇)中碳化硅纳米颗粒与铜共沉积的影响研究
在此,我们研究了铜和纳米铜复合材料在无表面活性剂和有表面活性剂两种情况下的电解沉积:一种是阳离子表面活性剂,即十二烷基硫酸钠(SDS);另一种是十六烷基三甲基溴化铵(CTAB),它来自金属氯盐在乙二醇-氯化胆碱共晶中的溶液。通过扫描电子显微镜(SEM)图像和 EDAX 分析,可以对微粒或微粒夹杂物进行原位定量。有趣的是,复合材料的成分与悬浮在溶液中的物种数量密切相关。这里的数据再次表明,大部分材料是被拖拽到表面,而不是沉淀在表面。复合材料在整个涂层中的分布是均匀的。这项技术之所以重要,是因为它有助于在没有氰化物等对环境不友好的助配位体的情况下沉积光亮的铜涂层。
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