H. Z. Korany, Abdulbasit Almhafdy, S. S. AlSaleem, Shi-jie Cao
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引用次数: 0
Abstract
This study used numerical modelling to analyze air velocity, cough particle distribution and infection risks in an isolation room. It investigated air change rates, inlet/outlet vent positioning and assessed various ventilation rates and outlet configurations for reducing infection risks. Quantitative assessments revealed different particle escape timings. In Case 1, smaller particles (2–4 μm) took 8.2 s to escape, while in Case 2, this time extended to 22.7 s. At 48 ACH, there were significant improvements in removing particles of various sizes, particularly those sized 2–4 μm, 16–24 μm and 40–50 μm, reducing the infection risk. The use of the Wells-Riley model highlighted considerable reductions in infection probabilities with higher ACH. Specifically, infection risks were reduced to 5% in Case 1 and 17% in Case 2, underscoring the marked advantage of Case 1 in reducing infection probabilities, particularly for smaller particles. Furthermore, escalated ACH values consistently correlated with decreased infection probabilities across all particle sizes, highlighting the pivotal role of ventilation rates in mitigating infection risks. The study comprehensively investigated the distribution of air velocity, dynamics of cough particles and infection risk associated with different ventilation strategies in isolation rooms.
期刊介绍:
ACS Applied Electronic Materials is an interdisciplinary journal publishing original research covering all aspects of electronic materials. The journal is devoted to reports of new and original experimental and theoretical research of an applied nature that integrate knowledge in the areas of materials science, engineering, optics, physics, and chemistry into important applications of electronic materials. Sample research topics that span the journal's scope are inorganic, organic, ionic and polymeric materials with properties that include conducting, semiconducting, superconducting, insulating, dielectric, magnetic, optoelectronic, piezoelectric, ferroelectric and thermoelectric.
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