ANALISIS KONSENTRASI PELARUT DAN KUAT ARUS TERHADAP KUALITAS PELAPISAN LOGAM PERAK (Ag) PADA LOGAM TEMBAGA (Cu)

Abstract

This study aims to analyze the effect of immersion time and current strength on the quality of the Ag layer, namely the mass, thickness and surface morphology of the best coating results. The electrode used was copper in the shape of a cylinder with a size of 5x0.2 cm and the electrolyte solution used was silver nitrate solution (AgNO3). The electroplating process in this study was carried out at 12 volts, with variations in electric current 4A, 6A, 8A for 30 minutes of immersion time and electrolyte concentrations of 0.6 M, 0.3 M and 0.1 M. Morphological characterization of the coated copper surface silver using SEM instruments. The results of the study obtained the sample with the best results from the weight value of the precipitated Ag metal, the thickness of the layer formed, namely copper samples treated (0.28 M, for 30 minutes). From the results of the SEM photos on the Cu/Ag surface, it can be seen that the samples electroplated for 30 minutes already contained a collection of small to medium lumps and the surface looked smooth and there were few pores on the copper surface resulting from silver electroplating.