Computational modelling and experimental investigation of micro-electrochemical discharge machining by controlling the electrolyte temperature

IF 2.4 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Journal of Micromechanics and Microengineering Pub Date : 2024-02-06 DOI:10.1088/1361-6439/ad2089
Dil Bahar, Akshay Dvivedi, Pradeep Kumar
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Abstract

Glass vias are emerging as a favourable option for radiofrequency-based micro-electromechanical system packaging. For the micromachining of glass, electrochemical discharge machining (ECDM) could be the most suitable technique if issues pertaining to the process stability are addressed thoroughly. The electrolyte temperature has immense influence on the viscosity and conductivity of the electrolyte, which percolate the stability of the ECDM process. Therefore, this article investigates the effects of the electrolyte temperature and applied voltage on the performance characteristics of ECDM for the micromachining of borosilicate glass. The machining rate (MR) and hole overcut (HOC) of the machined microholes are considered as performance characteristics. A 3D thermal-based finite element model (FEM) was developed for the thermal analysis in the machining zone. In the thermal analysis, the heat flux by thermal discharge was assumed to have Gaussian distribution, and accordingly, temperature profiles in the thermal zone were analyzed by controlling the electrolyte temperature and voltage at various levels. Further processing of temperature profiles in the thermal zone was utilized in the estimation of MR and HOC. Electrostatic-based FEM was utilized to assess the intensity of the electric field in the proximity of the tool electrode to analyze the probable locations of thermal discharge and its impact on the geometrical characteristics of the machined microholes. The simulation outcomes were validated experimentally, and show good agreement. A field emission electron microscope with energy dispersive spectroscopy was used for the characterization of the machined surface to observe the effect of the electrolyte temperature.
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通过控制电解质温度实现微电化学放电加工的计算建模和实验研究
玻璃孔正在成为基于射频的微型机电系统封装的有利选择。对于玻璃的微加工,如果能彻底解决与工艺稳定性有关的问题,电化学放电加工(ECDM)可能是最合适的技术。电解液温度对电解液的粘度和电导率有很大影响,而电解液的粘度和电导率又会影响 ECDM 工艺的稳定性。因此,本文研究了电解液温度和外加电压对 ECDM 微加工硼硅玻璃的性能特征的影响。已加工微孔的加工率(MR)和孔过切(HOC)被视为性能特征。为对加工区进行热分析,开发了基于三维热学的有限元模型(FEM)。在热分析中,假定热放电产生的热通量为高斯分布,因此通过控制不同水平的电解液温度和电压来分析热区的温度曲线。热区温度曲线的进一步处理被用于估算 MR 和 HOC。利用基于静电的有限元模型评估工具电极附近的电场强度,分析热放电的可能位置及其对加工微孔几何特征的影响。模拟结果经过实验验证,显示出良好的一致性。使用带有能量色散光谱的场发射电子显微镜对加工表面进行了表征,以观察电解液温度的影响。
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来源期刊
Journal of Micromechanics and Microengineering
Journal of Micromechanics and Microengineering 工程技术-材料科学:综合
CiteScore
4.50
自引率
4.30%
发文量
136
审稿时长
2.8 months
期刊介绍: Journal of Micromechanics and Microengineering (JMM) primarily covers experimental work, however relevant modelling papers are considered where supported by experimental data. The journal is focussed on all aspects of: -nano- and micro- mechanical systems -nano- and micro- electomechanical systems -nano- and micro- electrical and mechatronic systems -nano- and micro- engineering -nano- and micro- scale science Please note that we do not publish materials papers with no obvious application or link to nano- or micro-engineering. Below are some examples of the topics that are included within the scope of the journal: -MEMS and NEMS: Including sensors, optical MEMS/NEMS, RF MEMS/NEMS, etc. -Fabrication techniques and manufacturing: Including micromachining, etching, lithography, deposition, patterning, self-assembly, 3d printing, inkjet printing. -Packaging and Integration technologies. -Materials, testing, and reliability. -Micro- and nano-fluidics: Including optofluidics, acoustofluidics, droplets, microreactors, organ-on-a-chip. -Lab-on-a-chip and micro- and nano-total analysis systems. -Biomedical systems and devices: Including bio MEMS, biosensors, assays, organ-on-a-chip, drug delivery, cells, biointerfaces. -Energy and power: Including power MEMS/NEMS, energy harvesters, actuators, microbatteries. -Electronics: Including flexible electronics, wearable electronics, interface electronics. -Optical systems. -Robotics.
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