In-situ Analysis of the Effect of Ultrasonic Cavitation on Electrochemical Polishing of Additively Manufactured Metal Surfaces

Ji Ho Jeon, Sung-Hoon Ahn, S. Melkote
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Abstract

The effects of a hybrid process that combines ultrasonic cavitation and electrochemical polishing on the electrochemical behavior and the resulting surface characteristics of additively manufactured 316L stainless steel were investigated. In-situ potentiodynamic scans and electrochemical impedance spectroscopy (EIS) were conducted to gain fundamental understanding of the effect of ultrasonic cavitation on the electrochemical processes involved, considering the influence of electrolyte temperature at 60 and 70°C. The potentiodynamic scans revealed that increasing the ultrasonic excitation amplitude from 20 to 80 µm at 20 µm intervals and temperature from 60 to 70°C led to reduced polishing resistance, elevated passivation current density at equivalent applied potentials, thus leading to an increased polishing rate. These findings are attributed to intensified cavitation near the material surface, which promoted anodic dissolution reactions and accelerated the polishing rate. In-situ EIS measurements provided valuable information on the charge transfer resistance and double-layer capacitance and their influence on the hybrid process. Specifically, higher ultrasonic amplitudes and elevated temperatures contributed to enhanced electrical double-layer formation and ion adsorption, resulting in a faster rate of polishing, indicating the efficacy of the hybrid process. These findings enhance our understanding of the complex interactions between ultrasonic cavitation and electrochemical dissolution processes that occur during ultrasonic cavitation-assisted electrochemical polishing. The research provides valuable insights for optimizing the process and its potential application in post-processing of metal additive manufactured parts.
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超声波空化对增材制造金属表面电化学抛光影响的原位分析
研究了超声波空化和电化学抛光相结合的混合工艺对加成制造的 316L 不锈钢的电化学行为和由此产生的表面特性的影响。考虑到 60 和 70°C 电解液温度的影响,研究人员进行了原位电位扫描和电化学阻抗谱(EIS)分析,以从根本上了解超声空化对相关电化学过程的影响。电位扫描显示,将超声波激励振幅从 20 微米增加到 80 微米,间隔时间从 20 微米增加到 60 微米,温度从 60°C 增加到 70°C,可降低抛光电阻,提高等效应用电位下的钝化电流密度,从而提高抛光率。这些发现归因于材料表面附近的空化现象加剧,促进了阳极溶解反应,加快了抛光速度。原位 EIS 测量为电荷转移电阻和双层电容及其对混合过程的影响提供了有价值的信息。具体而言,较高的超声波振幅和较高的温度有助于增强双电层的形成和离子吸附,从而加快抛光速度,这表明了混合工艺的功效。这些发现加深了我们对超声空化和电化学溶解过程之间复杂互动关系的理解,这种互动关系发生在超声空化辅助电化学抛光过程中。这项研究为优化该工艺及其在金属添加剂制造部件后处理中的潜在应用提供了宝贵的见解。
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