Experimental approach for measuring the peeling strength of a sheet bonded on a curved adherend with pressure sensitive adhesive and predicting the peeling resistance by finite element analysis
{"title":"Experimental approach for measuring the peeling strength of a sheet bonded on a curved adherend with pressure sensitive adhesive and predicting the peeling resistance by finite element analysis","authors":"Akihiro Maesaka, Yushin Kakei, Tsutomu Osaka, Yoshihiro Kudo, Yu Sekiguchi, Chiaki Sato","doi":"10.1080/00218464.2024.2334340","DOIUrl":null,"url":null,"abstract":"To evaluate the peel resistance of a device wherein a polyimide (PI) sheet is bonded to a curved surface with a pressure-sensitive adhesive (PSA) experimentally and analytically, we applied a mecha...","PeriodicalId":501232,"journal":{"name":"The Journal of Adhesion","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2024-03-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"The Journal of Adhesion","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1080/00218464.2024.2334340","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
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Abstract
To evaluate the peel resistance of a device wherein a polyimide (PI) sheet is bonded to a curved surface with a pressure-sensitive adhesive (PSA) experimentally and analytically, we applied a mecha...