Challenges and Opportunities of Sub-6 GHz Integrated Sensing and Communications for 5G-Advanced and Beyond

IF 1.6 4区 计算机科学 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC Chinese Journal of Electronics Pub Date : 2024-03-01 DOI:10.23919/cje.2023.00.251
Yuhong Huang;Yongming Huang
{"title":"Challenges and Opportunities of Sub-6 GHz Integrated Sensing and Communications for 5G-Advanced and Beyond","authors":"Yuhong Huang;Yongming Huang","doi":"10.23919/cje.2023.00.251","DOIUrl":null,"url":null,"abstract":"The integrated sensing and communications (ISAC) technology has been perceived as a key feature of 5G-Advanced and beyond mobile communication networks. Compared with sensing in millimeter-wave bands, sensing at sub-6 GHz band is an exceptional incentive to promote the industrialization process of ISAC due to its incomparable advantages in industrial development, especially for intelligent transportation and smart drone networks. This paper elaborates on the top challenges of sub-6 GHz ISAC technologies, as well as the potential solutions to improve the sensing capability.","PeriodicalId":50701,"journal":{"name":"Chinese Journal of Electronics","volume":null,"pages":null},"PeriodicalIF":1.6000,"publicationDate":"2024-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10488076","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Chinese Journal of Electronics","FirstCategoryId":"94","ListUrlMain":"https://ieeexplore.ieee.org/document/10488076/","RegionNum":4,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0

Abstract

The integrated sensing and communications (ISAC) technology has been perceived as a key feature of 5G-Advanced and beyond mobile communication networks. Compared with sensing in millimeter-wave bands, sensing at sub-6 GHz band is an exceptional incentive to promote the industrialization process of ISAC due to its incomparable advantages in industrial development, especially for intelligent transportation and smart drone networks. This paper elaborates on the top challenges of sub-6 GHz ISAC technologies, as well as the potential solutions to improve the sensing capability.
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
面向 5G-Advanced 及其后的 6GHz 以下综合传感与通信技术的挑战与机遇
综合传感与通信(ISAC)技术已被视为5G-Advanced及更先进移动通信网络的关键特征。与毫米波频段的传感技术相比,6GHz以下频段的传感技术在产业发展中具有无可比拟的优势,特别是在智能交通和智能无人机网络方面,对推动ISAC的产业化进程具有特殊的激励作用。本文阐述了 6 GHz 以下 ISAC 技术面临的主要挑战,以及提高传感能力的潜在解决方案。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
Chinese Journal of Electronics
Chinese Journal of Electronics 工程技术-工程:电子与电气
CiteScore
3.70
自引率
16.70%
发文量
342
审稿时长
12.0 months
期刊介绍: CJE focuses on the emerging fields of electronics, publishing innovative and transformative research papers. Most of the papers published in CJE are from universities and research institutes, presenting their innovative research results. Both theoretical and practical contributions are encouraged, and original research papers reporting novel solutions to the hot topics in electronics are strongly recommended.
期刊最新文献
Front Cover Contents XPull: A Relay-Based Blockchain Intercommunication Framework Achieving Cross-Chain State Pulling Sharper Hardy Uncertainty Relations on Signal Concentration in Terms of Linear Canonical Transform An Efficient and Fast Area Optimization Approach for Mixed Polarity Reed-Muller Logic Circuits
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1