Bolong Zhou, Qiang Jia, Yishu Wang, Dan Li, Hongqiang Zhang, Huan Hu, Limin Ma, Guisheng Zou, Fu Guo
{"title":"Preparation of Ag-Cu nanoparticle film using a dual-beam pulsed laser deposition for power electronic packaging","authors":"Bolong Zhou, Qiang Jia, Yishu Wang, Dan Li, Hongqiang Zhang, Huan Hu, Limin Ma, Guisheng Zou, Fu Guo","doi":"10.2351/7.0001321","DOIUrl":null,"url":null,"abstract":"Ag-Cu nanoparticles, integrating the advantages of Ag and Cu, are promising materials for power electronic packaging. In this work, a novel dual-beam pulsed laser deposition method was proposed to prepare an Ag-Cu nanoparticle film with various component ratios and used for die attach at low temperatures. The as-deposited Ag-Cu nanoparticle film was mainly composed of Ag-Cu solid solution, Ag element, and Cu element, and most of the nanoparticles were in the alloying state. The Ag-Cu sintered joint presented a dense microstructure with 10.8% porosity, and the shear strength of Ag-Cu sintered joints could reach 60 MPa at 250 °C. The sintered joint porosity increased as more Cu were added in the Ag-Cu nanoparticle film, resulting in a decrease in the interfacial connection ratio. The fracture mode of sintered joints gradually changed from the sintered layer to the mixed sintered layer and interface fracture. The dual-beam pulsed laser deposition method could guide in designing the component ratios of bimetallic nanoparticles.","PeriodicalId":50168,"journal":{"name":"Journal of Laser Applications","volume":null,"pages":null},"PeriodicalIF":1.7000,"publicationDate":"2024-03-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Laser Applications","FirstCategoryId":"5","ListUrlMain":"https://doi.org/10.2351/7.0001321","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"MATERIALS SCIENCE, MULTIDISCIPLINARY","Score":null,"Total":0}
引用次数: 0
Abstract
Ag-Cu nanoparticles, integrating the advantages of Ag and Cu, are promising materials for power electronic packaging. In this work, a novel dual-beam pulsed laser deposition method was proposed to prepare an Ag-Cu nanoparticle film with various component ratios and used for die attach at low temperatures. The as-deposited Ag-Cu nanoparticle film was mainly composed of Ag-Cu solid solution, Ag element, and Cu element, and most of the nanoparticles were in the alloying state. The Ag-Cu sintered joint presented a dense microstructure with 10.8% porosity, and the shear strength of Ag-Cu sintered joints could reach 60 MPa at 250 °C. The sintered joint porosity increased as more Cu were added in the Ag-Cu nanoparticle film, resulting in a decrease in the interfacial connection ratio. The fracture mode of sintered joints gradually changed from the sintered layer to the mixed sintered layer and interface fracture. The dual-beam pulsed laser deposition method could guide in designing the component ratios of bimetallic nanoparticles.
期刊介绍:
The Journal of Laser Applications (JLA) is the scientific platform of the Laser Institute of America (LIA) and is published in cooperation with AIP Publishing. The high-quality articles cover a broad range from fundamental and applied research and development to industrial applications. Therefore, JLA is a reflection of the state-of-R&D in photonic production, sensing and measurement as well as Laser safety.
The following international and well known first-class scientists serve as allocated Editors in 9 new categories:
High Precision Materials Processing with Ultrafast Lasers
Laser Additive Manufacturing
High Power Materials Processing with High Brightness Lasers
Emerging Applications of Laser Technologies in High-performance/Multi-function Materials and Structures
Surface Modification
Lasers in Nanomanufacturing / Nanophotonics & Thin Film Technology
Spectroscopy / Imaging / Diagnostics / Measurements
Laser Systems and Markets
Medical Applications & Safety
Thermal Transportation
Nanomaterials and Nanoprocessing
Laser applications in Microelectronics.