{"title":"Effects of Misaligned Gate Lapping Over the Channel on Performances of Ultra-Thin Vertical-Pillar MOSFET","authors":"Soomin Kim, Seongjae Cho","doi":"10.1109/ICEIC61013.2024.10457234","DOIUrl":null,"url":null,"abstract":"In this work, the effects of misalignment between gate and channel edges on performances of an ultra-thin vertical-pillar MOSFET are investigated by a series of device simulations. The operation characteristics of the device as a function of degree of misalignment that might frequently exist between the gate and channel edges, in the actual device fabrication, have been quantitatively analyzed. In case of gate-drain overlap, there is little change in current characteristics but significant decrease in Ion and increase in Ioff were observed, when an excessive underlap was established, accompanying non-ideal effects including subthreshold swing (S) degradation and drain-induced barrier lowering (DIBL). Based on the results, the process margin can be figured.","PeriodicalId":518726,"journal":{"name":"2024 International Conference on Electronics, Information, and Communication (ICEIC)","volume":"370 2-3","pages":"1-2"},"PeriodicalIF":0.0000,"publicationDate":"2024-01-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2024 International Conference on Electronics, Information, and Communication (ICEIC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICEIC61013.2024.10457234","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
In this work, the effects of misalignment between gate and channel edges on performances of an ultra-thin vertical-pillar MOSFET are investigated by a series of device simulations. The operation characteristics of the device as a function of degree of misalignment that might frequently exist between the gate and channel edges, in the actual device fabrication, have been quantitatively analyzed. In case of gate-drain overlap, there is little change in current characteristics but significant decrease in Ion and increase in Ioff were observed, when an excessive underlap was established, accompanying non-ideal effects including subthreshold swing (S) degradation and drain-induced barrier lowering (DIBL). Based on the results, the process margin can be figured.